Recommended Books
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Temporary Bonding Adhesive (Laser Release, Thermal slide) Market, Trends, Business Strategies 2026-2034
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Temporary Bonding Adhesive (Laser Release, Thermal slide) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Temporary Bonding Adhesive (Laser Release, Thermal slide) Market was valued at USD 345 million in 2025 and is expected to reach USD 520 million by 2034, with a CAGR of 5.3% during the forecast period
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Fine Pitch RDL Photosensitive Dielectric Market, Trends, Business Strategies 2026-2034
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Fine Pitch RDL Photosensitive Dielectric Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Fine Pitch RDL Photosensitive Dielectric Market was valued at USD 0.85 billion in 2025 and is expected to reach USD 1.52 billion by 2034, exhibiting a CAGR of 6.2% during the forecast period.
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Glass Core Substrate (TGV – Through Glass Via) Market, Trends, Business Strategies 2026-2034
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Glass Core Substrate (TGV – Through Glass Via) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Core Substrate (TGV – Through Glass Via) Market size was valued at USD 245.6 million in 2025. The market is projected to grow from USD 257.3 million in 2025 to USD 462.8 million by 2034, exhibiting a CAGR of 7.1% during the forecast period.
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Fluoropolymer (PTFE) Laminate Market, Trends, Business Strategies 2026-2034
Global Fluoropolymer (PTFE) Laminate Market size was valued at USD 1.05 billion in 2025. The market is projected to grow from USD 1.12 billion in 2025 to USD 1.78 billion by 2034, exhibiting a CAGR of 5.4% during the forecast period.
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Liquid Crystal Polymer (LCP) Film for High Frequency Market, Trends, Business Strategies 2026-2034
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Liquid Crystal Polymer (LCP) Film for High Frequency Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Global Liquid Crystal Polymer (LCP) Film for High Frequency market size was valued at USD 410 million in 2025. The market is projected to grow from USD 430 million in 2025 to USD 720 million by 2034, exhibiting a CAGR of 6.0% during the forecast period.
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Prepreg (FR-4, High Tg, Low Dk) Material Market, Trends, Business Strategies 2026-2034
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Prepreg (FR-4, High Tg, Low Dk) Material Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Prepreg (FR-4, High Tg, Low Dk) Material market size was valued at USD 1.45 billion in 2025. The market is projected to grow from USD 1.53 billion in 2025 to USD 2.78 billion by 2034, exhibiting a CAGR of 7.1% during the forecast period.
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Copper Foil (Rolled, Electro-deposited) for Substrates Market, Trends, Business Strategies 2026-2034
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Copper Foil (Rolled, Electro-deposited) for Substrates Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Global Copper Foil (Rolled, Electro-deposited) for Substrates Market size was valued at USD 4.1 billion in 2025. The market is projected to grow from USD 4.3 billion in 2025 to USD 6.8 billion by 2034, exhibiting a CAGR of 5.5% during the forecast period.
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Build-up Film (Ajinomoto, Mitsubishi Gas) Market, Trends, Business Strategies 2026-2034
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Build-up Film (Ajinomoto, Mitsubishi Gas) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Build-up Film (Ajinomoto, Mitsubishi Gas) Market was valued at USD 1.05 billion in 2025 and is expected to reach USD 1.85 billion by 2034, exhibiting a CAGR of 6.1% during the forecast period.
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Surface Finish (ENIG, ENEPIG, OSP) for PCBs Market, Trends, Business Strategies 2026-2034
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Surface Finish (ENIG, ENEPIG, OSP) for PCBs Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Global Surface Finish (ENIG, ENEPIG, OSP) for PCBs Market size was valued at USD 1.45 billion in 2025. The market is projected to grow from USD 1.53 billion in 2025 to USD 2.45 billion by 2034, exhibiting a CAGR of 5.8% during the forecast period.
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Solder Resist (LPI, Dry Film) for Substrates Market, Trends, Business Strategies 2026-2034
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Solder Resist (LPI, Dry Film) for Substrates Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Solder Resist (LPI, dry film) For Substrates Market size was valued at USD 1.05 billion in 2025. The market is projected to grow from USD 1.12 billion in 2025 to USD 1.78 billion by 2034, exhibiting a CAGR of approximately 5.6% during the forecast period.
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Conductive Adhesive (Isotropic, Anisotropic) Market, Trends, Business Strategies 2026-2034
Global Conductive Adhesive (Isotropic, Anisotropic) Market size was valued at USD 1.05 billion in 2025. The market is projected to grow from USD 1.12 billion in 2025 to USD 1.89 billion by 2034, exhibiting a CAGR of 6.2% during the forecast period.
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Solder Sphere (BGA, Micro-ball) Market, Trends, Business Strategies 2026-2034
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Solder Sphere (BGA, Micro-ball) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Global Solder Sphere (BGA, micro-ball) Market size was valued at USD 1.05 billion in 2025. The market is projected to grow from USD 1.12 billion in 2026 to USD 1.85 billion by 2034, exhibiting a CAGR of 6.3% during the forecast period.
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Plastic Encapsulant (Epoxy Molding Compound) Market, Trends, Business Strategies 2026-2034
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Plastic Encapsulant (Epoxy Molding Compound) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Plastic Encapsulant (Epoxy Molding Compound) Market size was valued at USD 1.45 billion in 2025. The market is projected to grow from USD 1.53 billion in 2026 to USD 2.37 billion by 2034, exhibiting a CAGR of 5.6%
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Metal Package (Kovar, CuW) for Power Modules Market, Trends, Business Strategies 2026-2034
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Metal Package (Kovar, CuW) for Power Modules Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Metal Package (Kovar, CuW) for Power Modules Market was valued at USD 1.05 billion in 2025 and is expected to reach USD 1.78 billion by 2034, with a CAGR of 6.1%
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Ceramic Package (Alumina, AlN) Market, Trends, Business Strategies 2026-2034
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Ceramic Package (Alumina, AlN) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Global Ceramic Package (alumina, AlN) Market size was valued at USD 4.82 billion in 2025. The market is projected to grow from USD 5.14 billion in 2026 to USD 9.67 billion by 2034, exhibiting a CAGR of 8.2% during the forecast period.
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High Temperature Co-fired Ceramic (HTCC) Market, Trends, Business Strategies 2026-2034
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High Temperature Co-fired Ceramic (HTCC) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00High Temperature Co-fired Ceramic (HTCC) Market was valued at USD 1.19 billion in 2025 and is expected to reach USD 2.32 billion by 2034
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Low Temperature Co-fired Ceramic (LTCC) Substrate Market, Trends, Business Strategies 2026-2034
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Low Temperature Co-fired Ceramic (LTCC) Substrate Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Low Temperature Co-fired Ceramic (LTCC) Substrate Market was valued at USD 1.04 billion in 2025. The market is projected to grow from USD 1.12 billion in 2025 to USD 2.18 billion by 2034, exhibiting a CAGR of 7.6% during the forecast period.
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Dielectric Fill (Spin-on Glass, Flowable Oxide) Market, Trends, Business Strategies 2026-2034
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Dielectric Fill (Spin-on Glass, Flowable Oxide) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Dielectric Fill (Spin-on Glass, Flowable Oxide) Market was valued at USD 4.82 billion in 2025 and is expected to reach USD 9.67 billion by 2034, exhibiting a CAGR of 8.2% during the forecast period
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Thermal Interface Material (TIM, Grease, Phase Change) Market, Trends, Business Strategies 2026-2034
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Thermal Interface Material (TIM, Grease, Phase Change) Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Thermal Interface Material (TIM, Grease, Phase Change) Market was valued at USD 3.24 billion in 2025 and is expected to reach USD 6.15 billion by 2034, exhibiting a CAGR of 7.3%
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Solder Paste (Lead-free, SAC, Low Temp) for Advanced Packaging Market, Trends, Business Strategies 2026-2034
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Solder Paste (Lead-free, SAC, Low Temp) for Advanced Packaging Market, Trends, Business Strategies 2026-2034
Price range: $1,500.00 through $4,250.00Solder Paste (Lead-free, SAC, Low Temp) for Advanced Packaging Market size was valued at USD 1.47 billion in 2025. The market is projected to grow from USD 1.56 billion in 2026 to USD 2.89 billion by 2034, exhibiting a CAGR of 7.1%
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