The flexible printed circuit, or FPC, has become one of the less visible but increasingly important building blocks of modern electronics. It allows electrical connections to bend, fold and occupy irregular spaces where a conventional rigid printed circuit board would be difficult to install. That characteristic is becoming more valuable as consumer devices become thinner, […]
Semiconductor manufacturing tapes may look like supporting materials, but their role becomes critical once wafers move into grinding, dicing, thinning, mounting and advanced packaging. Dicing tapes hold wafers securely during separation, while temporary bonding, thermal-release and protective tapes help manufacturers handle increasingly thin wafers without damaging active structures. Nitto, for example, offers wafer tapes specifically […]
Electrical Fire Monitoring System (EFPS) is a dedicated early-warning arrangement that continuously tracks residual current (leakage) and temperature parameters in electrical circuits and equipment. When any measured value exceeds a preset threshold the system issues an alarm signal, generates a control output, and indicates the precise location of the anomaly. ABB – The Precision Watcher […]
The sound card has changed dramatically from the large expansion boards used in older desktop computers. Modern motherboards commonly integrate audio circuitry directly onto the board, combining an audio codec, DAC, amplifiers and software controls into a compact solution. This has made basic audio available without requiring a separate PCIe card. At the same time, […]
A machine does not need to move several meters to require highly precise sensing. Sometimes, a change of only a fraction of a degree can alter the position of a bucket, platform, robotic arm, antenna, agricultural implement or industrial structure. That is where industrial tilt sensors have become increasingly important. Modern devices combine MEMS accelerometers, […]
GaN and SiC power technology meets vertical power delivery as Navitas moves to extend its AI infrastructure portfolio from the grid to the xPU As AI accelerators demand increasingly higher currents, faster response times and greater power density, the bottleneck in next-generation data centers is shifting beyond computing performance itself. Navitas Semiconductor is responding with […]
The USB Y-cable occupies an unusual position in today’s connectivity landscape. It is neither a conventional charging lead nor a full USB hub. Instead, its defining feature is a split-end architecture that allows one connection point to interface with two downstream connectors, depending on the design and intended application. That simple geometry has kept Y-cables […]
Alloy resistors occupy a deceptively small position on a circuit board, but their function becomes critical when electronic systems need to measure current accurately. These components generally use a metal or metal-alloy resistive element engineered to provide a very low and stable resistance. The resulting voltage drop can then be measured to determine current flowing […]
The AC power plug is easy to overlook in a semiconductor facility. The attention usually goes to advanced chips, wafer equipment, AI processors and sophisticated power-management systems. Yet every one of these systems ultimately depends on a dependable connection to electrical power. In 2026, that basic connection is becoming more important as semiconductor factories, test […]
Power Integrations has introduced the industry’s first 2200V PowiGaN gallium nitride (GaN) technology, setting a new benchmark for high-voltage power semiconductors and opening new opportunities across AI data centers, electric vehicles, renewable energy systems, and high-voltage direct current (HVDC) infrastructure. The breakthrough significantly extends the operating range of commercial GaN devices, enabling next-generation power architectures […]
