IC Package Substrates Market, Emerging Trends, Technological Advancements, and Business Strategies 2025-2032

The global IC Package Substrates Market was valued at million in 2024 and is projected to reach US$ million by 2031, at a CAGR of %during the forecast period.

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IC Package Substrates Market Analysis:

The global IC Package Substrates Market was valued at million in 2024 and is projected to reach US$ million by 2031, at a CAGR of %during the forecast period.

IC Package Substrates Market Overview

An IC substrate is a crucial carrier material for integrated circuits, featuring internal circuitry that connects semiconductor chips to printed circuit boards (PCBs). These substrates not only provide electrical connectivity but also serve multiple functions:

  • Protecting the circuit and sensitive components

  • Managing heat dissipation

  • Serving as a standardized module for IC components

IC substrates are essential in IC packaging, accounting for approximately 35% to 55% of the total packaging materials.

Key Manufacturers in China

Leading suppliers of IC package substrates in China include:

  • SCC

  • Nanya

  • Access Substrates

The top three manufacturers hold a combined market share of over 50%, indicating a relatively consolidated market landscape.

Product Segmentation by Package Type

  • WB BGA (Wire Bond Ball Grid Array) – 39% market share

  • FC-CSP (Flip Chip Chip Scale Package) – 38% market share

 These packaging types are widely adopted for different performance and size requirements in electronic devices.

We have surveyed the IC Package Substrates manufacturers, suppliers, distributors, and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates. This report contains market size and forecasts of IC Package Substrates in global, including the following market information:

  • Global IC Package Substrates market revenue, 2020-2025, 2026-2031, ($ millions)
  • Global IC Package Substrates market sales, 2020-2025, 2026-2031, (K Sqm)
  • Global top five IC Package Substrates companies in 2024 (%)

IC Package Substrates Key Market Trends  :

  • Rising Adoption in Smartphones and PCs
    Smartphones and personal computing devices (laptops and tablets) continue to be the dominant applications, accounting for over 85% of market usage.

  • Technological Shift Toward FC-CSP and WB BGA
    Advanced packaging technologies like FC-CSP (38%) and WB BGA (39%) are leading the market due to their high performance and compact designs.

  • Strong Manufacturing Base in China
    China remains a dominant player with key manufacturers like SCC, Nanya, and Access Substrates holding over 50% market share.

  • Increased Focus on Heat Dissipation and Reliability
    Demand for substrates with better heat management and electrical performance is driving innovations in IC packaging.

  • Market Consolidation and Strategic Alliances
    Leading companies are expanding via mergers and strategic collaborations to increase market reach and production capabilities.

IC Package Substrates Market Regional Analysis :

semi insight

  • North America:

    Strong demand driven by EVs, 5G infrastructure, and renewable energy, with the U.S. leading the market.

  • Europe:

    Growth fueled by automotive electrification, renewable energy, and strong regulatory support, with Germany as a key player.

  • Asia-Pacific:

    Dominates the market due to large-scale manufacturing in China and Japan, with growing demand from EVs, 5G, and semiconductors.

  • South America:

    Emerging market, driven by renewable energy and EV adoption, with Brazil leading growth.

  • Middle East & Africa:

    Gradual growth, mainly due to investments in renewable energy and EV infrastructure, with Saudi Arabia and UAE as key contributors.

Total Market by Segment:

Global IC Package Substrates market, by Type, 2020-2025, 2026-2031 ($ millions) & (K Sqm)
Global IC Package Substrates market segment percentages, by Type, 2024 (%)

  • FC-BGA
  • FC-CSP
  • WB BGA
  • WB CSP
  • RF Module
  • Others

Global IC Package Substrates market, by Application, 2020-2025, 2026-2031 ($ Millions) & (K Sqm)
Global IC Package Substrates market segment percentages, by Application, 2024 (%)

  • Smart Phone
  • PC (tablet and Laptop)
  • Wearable Device
  • Others
  • Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:

  • Key companies IC Package Substrates revenues in global market, 2020-2025 (estimated), ($ millions)
  • Key companies IC Package Substrates revenues share in global market, 2024 (%)
  • Key companies IC Package Substrates sales in global market, 2020-2025 (estimated), (K Sqm)
  • Key companies IC Package Substrates sales share in global market, 2024 (%)

Further, the report presents profiles of competitors in the market, key players include:

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S
  • Semco
  • Kyocera
  • TOPPAN
  • Zhen Ding Technology
  • Daeduck Electronics
  • ASE Material
  • LG InnoTek
  • Simmtech
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech
  • ACCESS
  • Suntak Technology
  • National Center for Advanced Packaging (NCAP China)
  • Huizhou China Eagle Electronic Technology
  • DSBJ
  • Shenzhen Kinwong Electronic
  • AKM Meadville
  • Victory Giant Technology

Market Drivers

  • Growing Demand for Consumer Electronics
    With rising global sales of smartphones, tablets, and laptops, the need for efficient IC package substrates has grown significantly.

  • Miniaturization of Electronic Devices
    As devices become smaller and more powerful, there’s an increased need for advanced substrates like FC-CSP and WB BGA for compact IC integration.

  • Advancement in Semiconductor Packaging Technologies
    Ongoing innovations in semiconductor design and packaging are pushing the adoption of high-performance substrates for various applications.

Market Restraints

  • High Manufacturing Costs
    Advanced IC package substrates involve complex and costly manufacturing processes, which can limit adoption among smaller companies.

  • Supply Chain Disruptions
    Fluctuations in raw material availability and global shipping challenges may hinder consistent production and supply.

  • Technical Barriers for New Entrants
    The IC substrate market demands high technical expertise and infrastructure, creating entry barriers for new players.

Market Opportunities

  • Emerging Applications in Wearable Devices
    The rising popularity of smartwatches and fitness trackers creates new demand for smaller, reliable IC package substrates.

  • Growth in 5G and IoT Devices
    The rapid expansion of 5G networks and IoT-connected gadgets opens up new growth avenues for advanced substrate solutions.

  • Geographic Expansion of Key Players
    Global players expanding into untapped regions, particularly in Southeast Asia and the Middle East, present significant growth potential.

Market Challenges

  • High Competition Among Leading Players
    The dominance of top companies with large market shares makes it challenging for mid-tier or new entrants to gain traction.

  • Constant Need for R&D Investment
    To stay competitive, manufacturers must continually invest in research, which adds to operational costs.

  • Environmental and Regulatory Constraints
    Stricter environmental norms and regulations related to semiconductor manufacturing could slow down the pace of expansion.

FAQs

Q1. What are the key driving factors and opportunities in the IC Package Substrates market?
A: The main drivers include growing consumer electronics demand and semiconductor packaging innovations. Opportunities lie in 5G, IoT, and wearable device expansion.

Q2. Which region is projected to have the largest market share?
A: China is projected to dominate the market due to its strong manufacturing base and presence of major players.

Q3. Who are the top players in the global IC Package Substrates market?
A: Key players include SCC, Nanya, and Access Substrates, collectively accounting for over 50% of the market.

Q4. What are the latest technological advancements in the industry?
A: Advancements include improved heat dissipation designs and the widespread adoption of FC-CSP and WB BGA packaging.

Q5. What is the current size of the global IC Package Substrates market?
A: The market was valued at several million USD in 2024 and is projected to reach a significantly higher value by 2031.

IC Package Substrates Market, Emerging Trends, Technological Advancements, and Business Strategies 2025-2032

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Table of Content

1 Introduction to Research & Analysis Reports
1.1 IC Package Substrates Market Definition
1.2 Market Segments
1.2.1 Segment by Type
1.2.2 Segment by Application
1.3 Global IC Package Substrates Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global IC Package Substrates Overall Market Size
2.1 Global IC Package Substrates Market Size: 2024 VS 2031
2.2 Global IC Package Substrates Market Size, Prospects & Forecasts: 2020-2031
2.3 Global IC Package Substrates Sales: 2020-2031
3 Company Landscape
3.1 Top IC Package Substrates Players in Global Market
3.2 Top Global IC Package Substrates Companies Ranked by Revenue
3.3 Global IC Package Substrates Revenue by Companies
3.4 Global IC Package Substrates Sales by Companies
3.5 Global IC Package Substrates Price by Manufacturer (2020-2025)
3.6 Top 3 and Top 5 IC Package Substrates Companies in Global Market, by Revenue in 2024
3.7 Global Manufacturers IC Package Substrates Product Type
3.8 Tier 1, Tier 2, and Tier 3 IC Package Substrates Players in Global Market
3.8.1 List of Global Tier 1 IC Package Substrates Companies
3.8.2 List of Global Tier 2 and Tier 3 IC Package Substrates Companies
4 Sights by Product
4.1 Overview
4.1.1 Segment by Type – Global IC Package Substrates Market Size Markets, 2024 & 2031
4.1.2 FC-BGA
4.1.3 FC-CSP
4.1.4 WB BGA
4.1.5 WB CSP
4.1.6 RF Module
4.1.7 Others
4.2 Segment by Type – Global IC Package Substrates Revenue & Forecasts
4.2.1 Segment by Type – Global IC Package Substrates Revenue, 2020-2025
4.2.2 Segment by Type – Global IC Package Substrates Revenue, 2026-2031
4.2.3 Segment by Type – Global IC Package Substrates Revenue Market Share, 2020-2031
4.3 Segment by Type – Global IC Package Substrates Sales & Forecasts
4.3.1 Segment by Type – Global IC Package Substrates Sales, 2020-2025
4.3.2 Segment by Type – Global IC Package Substrates Sales, 2026-2031
4.3.3 Segment by Type – Global IC Package Substrates Sales Market Share, 2020-2031
4.4 Segment by Type – Global IC Package Substrates Price (Manufacturers Selling Prices), 2020-2031
5 Sights by Application
5.1 Overview
5.1.1 Segment by Application – Global IC Package Substrates Market Size, 2024 & 2031
5.1.2 Smart Phone
5.1.3 PC (tablet and Laptop)
5.1.4 Wearable Device
5.1.5 Others
5.2 Segment by Application – Global IC Package Substrates Revenue & Forecasts
5.2.1 Segment by Application – Global IC Package Substrates Revenue, 2020-2025
5.2.2 Segment by Application – Global IC Package Substrates Revenue, 2026-2031
5.2.3 Segment by Application – Global IC Package Substrates Revenue Market Share, 2020-2031
5.3 Segment by Application – Global IC Package Substrates Sales & Forecasts
5.3.1 Segment by Application – Global IC Package Substrates Sales, 2020-2025
5.3.2 Segment by Application – Global IC Package Substrates Sales, 2026-2031
5.3.3 Segment by Application – Global IC Package Substrates Sales Market Share, 2020-2031
5.4 Segment by Application – Global IC Package Substrates Price (Manufacturers Selling Prices), 2020-2031
6 Sights by Region
6.1 By Region – Global IC Package Substrates Market Size, 2024 & 2031
6.2 By Region – Global IC Package Substrates Revenue & Forecasts
6.2.1 By Region – Global IC Package Substrates Revenue, 2020-2025
6.2.2 By Region – Global IC Package Substrates Revenue, 2026-2031
6.2.3 By Region – Global IC Package Substrates Revenue Market Share, 2020-2031
6.3 By Region – Global IC Package Substrates Sales & Forecasts
6.3.1 By Region – Global IC Package Substrates Sales, 2020-2025
6.3.2 By Region – Global IC Package Substrates Sales, 2026-2031
6.3.3 By Region – Global IC Package Substrates Sales Market Share, 2020-2031
6.4 North America
6.4.1 By Country – North America IC Package Substrates Revenue, 2020-2031
6.4.2 By Country – North America IC Package Substrates Sales, 2020-2031
6.4.3 United States IC Package Substrates Market Size, 2020-2031
6.4.4 Canada IC Package Substrates Market Size, 2020-2031
6.4.5 Mexico IC Package Substrates Market Size, 2020-2031
6.5 Europe
6.5.1 By Country – Europe IC Package Substrates Revenue, 2020-2031
6.5.2 By Country – Europe IC Package Substrates Sales, 2020-2031
6.5.3 Germany IC Package Substrates Market Size, 2020-2031
6.5.4 France IC Package Substrates Market Size, 2020-2031
6.5.5 U.K. IC Package Substrates Market Size, 2020-2031
6.5.6 Italy IC Package Substrates Market Size, 2020-2031
6.5.7 Russia IC Package Substrates Market Size, 2020-2031
6.5.8 Nordic Countries IC Package Substrates Market Size, 2020-2031
6.5.9 Benelux IC Package Substrates Market Size, 2020-2031
6.6 Asia
6.6.1 By Region – Asia IC Package Substrates Revenue, 2020-2031
6.6.2 By Region – Asia IC Package Substrates Sales, 2020-2031
6.6.3 China IC Package Substrates Market Size, 2020-2031
6.6.4 Japan IC Package Substrates Market Size, 2020-2031
6.6.5 South Korea IC Package Substrates Market Size, 2020-2031
6.6.6 Southeast Asia IC Package Substrates Market Size, 2020-2031
6.6.7 India IC Package Substrates Market Size, 2020-2031
6.7 South America
6.7.1 By Country – South America IC Package Substrates Revenue, 2020-2031
6.7.2 By Country – South America IC Package Substrates Sales, 2020-2031
6.7.3 Brazil IC Package Substrates Market Size, 2020-2031
6.7.4 Argentina IC Package Substrates Market Size, 2020-2031
6.8 Middle East & Africa
6.8.1 By Country – Middle East & Africa IC Package Substrates Revenue, 2020-2031
6.8.2 By Country – Middle East & Africa IC Package Substrates Sales, 2020-2031
6.8.3 Turkey IC Package Substrates Market Size, 2020-2031
6.8.4 Israel IC Package Substrates Market Size, 2020-2031
6.8.5 Saudi Arabia IC Package Substrates Market Size, 2020-2031
6.8.6 UAE IC Package Substrates Market Size, 2020-2031
7 Manufacturers & Brands Profiles
7.1 Unimicron
7.1.1 Unimicron Company Summary
7.1.2 Unimicron Business Overview
7.1.3 Unimicron IC Package Substrates Major Product Offerings
7.1.4 Unimicron IC Package Substrates Sales and Revenue in Global (2020-2025)
7.1.5 Unimicron Key News & Latest Developments
7.2 Ibiden
7.2.1 Ibiden Company Summary
7.2.2 Ibiden Business Overview
7.2.3 Ibiden IC Package Substrates Major Product Offerings
7.2.4 Ibiden IC Package Substrates Sales and Revenue in Global (2020-2025)
7.2.5 Ibiden Key News & Latest Developments
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB Company Summary
7.3.2 Nan Ya PCB Business Overview
7.3.3 Nan Ya PCB IC Package Substrates Major Product Offerings
7.3.4 Nan Ya PCB IC Package Substrates Sales and Revenue in Global (2020-2025)
7.3.5 Nan Ya PCB Key News & Latest Developments
7.4 Shinko Electric Industries
7.4.1 Shinko Electric Industries Company Summary
7.4.2 Shinko Electric Industries Business Overview
7.4.3 Shinko Electric Industries IC Package Substrates Major Product Offerings
7.4.4 Shinko Electric Industries IC Package Substrates Sales and Revenue in Global (2020-2025)
7.4.5 Shinko Electric Industries Key News & Latest Developments
7.5 Kinsus Interconnect Technology
7.5.1 Kinsus Interconnect Technology Company Summary
7.5.2 Kinsus Interconnect Technology Business Overview
7.5.3 Kinsus Interconnect Technology IC Package Substrates Major Product Offerings
7.5.4 Kinsus Interconnect Technology IC Package Substrates Sales and Revenue in Global (2020-2025)
7.5.5 Kinsus Interconnect Technology Key News & Latest Developments
7.6 AT&S
7.6.1 AT&S Company Summary
7.6.2 AT&S Business Overview
7.6.3 AT&S IC Package Substrates Major Product Offerings
7.6.4 AT&S IC Package Substrates Sales and Revenue in Global (2020-2025)
7.6.5 AT&S Key News & Latest Developments
7.7 Semco
7.7.1 Semco Company Summary
7.7.2 Semco Business Overview
7.7.3 Semco IC Package Substrates Major Product Offerings
7.7.4 Semco IC Package Substrates Sales and Revenue in Global (2020-2025)
7.7.5 Semco Key News & Latest Developments
7.8 Kyocera
7.8.1 Kyocera Company Summary
7.8.2 Kyocera Business Overview
7.8.3 Kyocera IC Package Substrates Major Product Offerings
7.8.4 Kyocera IC Package Substrates Sales and Revenue in Global (2020-2025)
7.8.5 Kyocera Key News & Latest Developments
7.9 TOPPAN
7.9.1 TOPPAN Company Summary
7.9.2 TOPPAN Business Overview
7.9.3 TOPPAN IC Package Substrates Major Product Offerings
7.9.4 TOPPAN IC Package Substrates Sales and Revenue in Global (2020-2025)
7.9.5 TOPPAN Key News & Latest Developments
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology Company Summary
7.10.2 Zhen Ding Technology Business Overview
7.10.3 Zhen Ding Technology IC Package Substrates Major Product Offerings
7.10.4 Zhen Ding Technology IC Package Substrates Sales and Revenue in Global (2020-2025)
7.10.5 Zhen Ding Technology Key News & Latest Developments
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics Company Summary
7.11.2 Daeduck Electronics Business Overview
7.11.3 Daeduck Electronics IC Package Substrates Major Product Offerings
7.11.4 Daeduck Electronics IC Package Substrates Sales and Revenue in Global (2020-2025)
7.11.5 Daeduck Electronics Key News & Latest Developments
7.12 ASE Material
7.12.1 ASE Material Company Summary
7.12.2 ASE Material Business Overview
7.12.3 ASE Material IC Package Substrates Major Product Offerings
7.12.4 ASE Material IC Package Substrates Sales and Revenue in Global (2020-2025)
7.12.5 ASE Material Key News & Latest Developments
7.13 LG InnoTek
7.13.1 LG InnoTek Company Summary
7.13.2 LG InnoTek Business Overview
7.13.3 LG InnoTek IC Package Substrates Major Product Offerings
7.13.4 LG InnoTek IC Package Substrates Sales and Revenue in Global (2020-2025)
7.13.5 LG InnoTek Key News & Latest Developments
7.14 Simmtech
7.14.1 Simmtech Company Summary
7.14.2 Simmtech Business Overview
7.14.3 Simmtech IC Package Substrates Major Product Offerings
7.14.4 Simmtech IC Package Substrates Sales and Revenue in Global (2020-2025)
7.14.5 Simmtech Key News & Latest Developments
7.15 Shennan Circuit
7.15.1 Shennan Circuit Company Summary
7.15.2 Shennan Circuit Business Overview
7.15.3 Shennan Circuit IC Package Substrates Major Product Offerings
7.15.4 Shennan Circuit IC Package Substrates Sales and Revenue in Global (2020-2025)
7.15.5 Shennan Circuit Key News & Latest Developments
7.16 Shenzhen Fastprint Circuit Tech
7.16.1 Shenzhen Fastprint Circuit Tech Company Summary
7.16.2 Shenzhen Fastprint Circuit Tech Business Overview
7.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Major Product Offerings
7.16.4 Shenzhen Fastprint Circuit Tech IC Package Substrates Sales and Revenue in Global (2020-2025)
7.16.5 Shenzhen Fastprint Circuit Tech Key News & Latest Developments
7.17 ACCESS
7.17.1 ACCESS Company Summary
7.17.2 ACCESS Business Overview
7.17.3 ACCESS IC Package Substrates Major Product Offerings
7.17.4 ACCESS IC Package Substrates Sales and Revenue in Global (2020-2025)
7.17.5 ACCESS Key News & Latest Developments
7.18 Suntak Technology
7.18.1 Suntak Technology Company Summary
7.18.2 Suntak Technology Business Overview
7.18.3 Suntak Technology IC Package Substrates Major Product Offerings
7.18.4 Suntak Technology IC Package Substrates Sales and Revenue in Global (2020-2025)
7.18.5 Suntak Technology Key News & Latest Developments
7.19 National Center for Advanced Packaging (NCAP China)
7.19.1 National Center for Advanced Packaging (NCAP China) Company Summary
7.19.2 National Center for Advanced Packaging (NCAP China) Business Overview
7.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Major Product Offerings
7.19.4 National Center for Advanced Packaging (NCAP China) IC Package Substrates Sales and Revenue in Global (2020-2025)
7.19.5 National Center for Advanced Packaging (NCAP China) Key News & Latest Developments
7.20 Huizhou China Eagle Electronic Technology
7.20.1 Huizhou China Eagle Electronic Technology Company Summary
7.20.2 Huizhou China Eagle Electronic Technology Business Overview
7.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Major Product Offerings
7.20.4 Huizhou China Eagle Electronic Technology IC Package Substrates Sales and Revenue in Global (2020-2025)
7.20.5 Huizhou China Eagle Electronic Technology Key News & Latest Developments
7.21 DSBJ
7.21.1 DSBJ Company Summary
7.21.2 DSBJ Business Overview
7.21.3 DSBJ IC Package Substrates Major Product Offerings
7.21.4 DSBJ IC Package Substrates Sales and Revenue in Global (2020-2025)
7.21.5 DSBJ Key News & Latest Developments
7.22 Shenzhen Kinwong Electronic
7.22.1 Shenzhen Kinwong Electronic Company Summary
7.22.2 Shenzhen Kinwong Electronic Business Overview
7.22.3 Shenzhen Kinwong Electronic IC Package Substrates Major Product Offerings
7.22.4 Shenzhen Kinwong Electronic IC Package Substrates Sales and Revenue in Global (2020-2025)
7.22.5 Shenzhen Kinwong Electronic Key News & Latest Developments
7.23 AKM Meadville
7.23.1 AKM Meadville Company Summary
7.23.2 AKM Meadville Business Overview
7.23.3 AKM Meadville IC Package Substrates Major Product Offerings
7.23.4 AKM Meadville IC Package Substrates Sales and Revenue in Global (2020-2025)
7.23.5 AKM Meadville Key News & Latest Developments
7.24 Victory Giant Technology
7.24.1 Victory Giant Technology Company Summary
7.24.2 Victory Giant Technology Business Overview
7.24.3 Victory Giant Technology IC Package Substrates Major Product Offerings
7.24.4 Victory Giant Technology IC Package Substrates Sales and Revenue in Global (2020-2025)
7.24.5 Victory Giant Technology Key News & Latest Developments
8 Global IC Package Substrates Production Capacity, Analysis
8.1 Global IC Package Substrates Production Capacity, 2020-2031
8.2 IC Package Substrates Production Capacity of Key Manufacturers in Global Market
8.3 Global IC Package Substrates Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
9.1 Market Opportunities & Trends
9.2 Market Drivers
9.3 Market Restraints
10 IC Package Substrates Supply Chain Analysis
10.1 IC Package Substrates Industry Value Chain
10.2 IC Package Substrates Upstream Market
10.3 IC Package Substrates Downstream and Clients
10.4 Marketing Channels Analysis
10.4.1 Marketing Channels
10.4.2 IC Package Substrates Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
12.1 Note
12.2 Examples of Clients
12.3 DisclaimerList of Tables
Table 1. Key Players of IC Package Substrates in Global Market
Table 2. Top IC Package Substrates Players in Global Market, Ranking by Revenue (2024)
Table 3. Global IC Package Substrates Revenue by Companies, (US$, Mn), 2020-2025
Table 4. Global IC Package Substrates Revenue Share by Companies, 2020-2025
Table 5. Global IC Package Substrates Sales by Companies, (K Sqm), 2020-2025
Table 6. Global IC Package Substrates Sales Share by Companies, 2020-2025
Table 7. Key Manufacturers IC Package Substrates Price (2020-2025) & (US$/Sqm)
Table 8. Global Manufacturers IC Package Substrates Product Type
Table 9. List of Global Tier 1 IC Package Substrates Companies, Revenue (US$, Mn) in 2024 and Market Share
Table 10. List of Global Tier 2 and Tier 3 IC Package Substrates Companies, Revenue (US$, Mn) in 2024 and Market Share
Table 11. Segment by Type – Global IC Package Substrates Revenue, (US$, Mn), 2024 & 2031
Table 12. Segment by Type – Global IC Package Substrates Revenue (US$, Mn), 2020-2025
Table 13. Segment by Type – Global IC Package Substrates Revenue (US$, Mn), 2026-2031
Table 14. Segment by Type – Global IC Package Substrates Sales (K Sqm), 2020-2025
Table 15. Segment by Type – Global IC Package Substrates Sales (K Sqm), 2026-2031
Table 16. Segment by Application – Global IC Package Substrates Revenue, (US$, Mn), 2024 & 2031
Table 17. Segment by Application – Global IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 18. Segment by Application – Global IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 19. Segment by Application – Global IC Package Substrates Sales, (K Sqm), 2020-2025
Table 20. Segment by Application – Global IC Package Substrates Sales, (K Sqm), 2026-2031
Table 21. By Region – Global IC Package Substrates Revenue, (US$, Mn), 2025-2031
Table 22. By Region – Global IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 23. By Region – Global IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 24. By Region – Global IC Package Substrates Sales, (K Sqm), 2020-2025
Table 25. By Region – Global IC Package Substrates Sales, (K Sqm), 2026-2031
Table 26. By Country – North America IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 27. By Country – North America IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 28. By Country – North America IC Package Substrates Sales, (K Sqm), 2020-2025
Table 29. By Country – North America IC Package Substrates Sales, (K Sqm), 2026-2031
Table 30. By Country – Europe IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 31. By Country – Europe IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 32. By Country – Europe IC Package Substrates Sales, (K Sqm), 2020-2025
Table 33. By Country – Europe IC Package Substrates Sales, (K Sqm), 2026-2031
Table 34. By Region – Asia IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 35. By Region – Asia IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 36. By Region – Asia IC Package Substrates Sales, (K Sqm), 2020-2025
Table 37. By Region – Asia IC Package Substrates Sales, (K Sqm), 2026-2031
Table 38. By Country – South America IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 39. By Country – South America IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 40. By Country – South America IC Package Substrates Sales, (K Sqm), 2020-2025
Table 41. By Country – South America IC Package Substrates Sales, (K Sqm), 2026-2031
Table 42. By Country – Middle East & Africa IC Package Substrates Revenue, (US$, Mn), 2020-2025
Table 43. By Country – Middle East & Africa IC Package Substrates Revenue, (US$, Mn), 2026-2031
Table 44. By Country – Middle East & Africa IC Package Substrates Sales, (K Sqm), 2020-2025
Table 45. By Country – Middle East & Africa IC Package Substrates Sales, (K Sqm), 2026-2031
Table 46. Unimicron Company Summary
Table 47. Unimicron IC Package Substrates Product Offerings
Table 48. Unimicron IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 49. Unimicron Key News & Latest Developments
Table 50. Ibiden Company Summary
Table 51. Ibiden IC Package Substrates Product Offerings
Table 52. Ibiden IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 53. Ibiden Key News & Latest Developments
Table 54. Nan Ya PCB Company Summary
Table 55. Nan Ya PCB IC Package Substrates Product Offerings
Table 56. Nan Ya PCB IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 57. Nan Ya PCB Key News & Latest Developments
Table 58. Shinko Electric Industries Company Summary
Table 59. Shinko Electric Industries IC Package Substrates Product Offerings
Table 60. Shinko Electric Industries IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 61. Shinko Electric Industries Key News & Latest Developments
Table 62. Kinsus Interconnect Technology Company Summary
Table 63. Kinsus Interconnect Technology IC Package Substrates Product Offerings
Table 64. Kinsus Interconnect Technology IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 65. Kinsus Interconnect Technology Key News & Latest Developments
Table 66. AT&S Company Summary
Table 67. AT&S IC Package Substrates Product Offerings
Table 68. AT&S IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 69. AT&S Key News & Latest Developments
Table 70. Semco Company Summary
Table 71. Semco IC Package Substrates Product Offerings
Table 72. Semco IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 73. Semco Key News & Latest Developments
Table 74. Kyocera Company Summary
Table 75. Kyocera IC Package Substrates Product Offerings
Table 76. Kyocera IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 77. Kyocera Key News & Latest Developments
Table 78. TOPPAN Company Summary
Table 79. TOPPAN IC Package Substrates Product Offerings
Table 80. TOPPAN IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 81. TOPPAN Key News & Latest Developments
Table 82. Zhen Ding Technology Company Summary
Table 83. Zhen Ding Technology IC Package Substrates Product Offerings
Table 84. Zhen Ding Technology IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 85. Zhen Ding Technology Key News & Latest Developments
Table 86. Daeduck Electronics Company Summary
Table 87. Daeduck Electronics IC Package Substrates Product Offerings
Table 88. Daeduck Electronics IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 89. Daeduck Electronics Key News & Latest Developments
Table 90. ASE Material Company Summary
Table 91. ASE Material IC Package Substrates Product Offerings
Table 92. ASE Material IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 93. ASE Material Key News & Latest Developments
Table 94. LG InnoTek Company Summary
Table 95. LG InnoTek IC Package Substrates Product Offerings
Table 96. LG InnoTek IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 97. LG InnoTek Key News & Latest Developments
Table 98. Simmtech Company Summary
Table 99. Simmtech IC Package Substrates Product Offerings
Table 100. Simmtech IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 101. Simmtech Key News & Latest Developments
Table 102. Shennan Circuit Company Summary
Table 103. Shennan Circuit IC Package Substrates Product Offerings
Table 104. Shennan Circuit IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 105. Shennan Circuit Key News & Latest Developments
Table 106. Shenzhen Fastprint Circuit Tech Company Summary
Table 107. Shenzhen Fastprint Circuit Tech IC Package Substrates Product Offerings
Table 108. Shenzhen Fastprint Circuit Tech IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 109. Shenzhen Fastprint Circuit Tech Key News & Latest Developments
Table 110. ACCESS Company Summary
Table 111. ACCESS IC Package Substrates Product Offerings
Table 112. ACCESS IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 113. ACCESS Key News & Latest Developments
Table 114. Suntak Technology Company Summary
Table 115. Suntak Technology IC Package Substrates Product Offerings
Table 116. Suntak Technology IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 117. Suntak Technology Key News & Latest Developments
Table 118. National Center for Advanced Packaging (NCAP China) Company Summary
Table 119. National Center for Advanced Packaging (NCAP China) IC Package Substrates Product Offerings
Table 120. National Center for Advanced Packaging (NCAP China) IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 121. National Center for Advanced Packaging (NCAP China) Key News & Latest Developments
Table 122. Huizhou China Eagle Electronic Technology Company Summary
Table 123. Huizhou China Eagle Electronic Technology IC Package Substrates Product Offerings
Table 124. Huizhou China Eagle Electronic Technology IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 125. Huizhou China Eagle Electronic Technology Key News & Latest Developments
Table 126. DSBJ Company Summary
Table 127. DSBJ IC Package Substrates Product Offerings
Table 128. DSBJ IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 129. DSBJ Key News & Latest Developments
Table 130. Shenzhen Kinwong Electronic Company Summary
Table 131. Shenzhen Kinwong Electronic IC Package Substrates Product Offerings
Table 132. Shenzhen Kinwong Electronic IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 133. Shenzhen Kinwong Electronic Key News & Latest Developments
Table 134. AKM Meadville Company Summary
Table 135. AKM Meadville IC Package Substrates Product Offerings
Table 136. AKM Meadville IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 137. AKM Meadville Key News & Latest Developments
Table 138. Victory Giant Technology Company Summary
Table 139. Victory Giant Technology IC Package Substrates Product Offerings
Table 140. Victory Giant Technology IC Package Substrates Sales (K Sqm), Revenue (US$, Mn) and Average Price (US$/Sqm) & (2020-2025)
Table 141. Victory Giant Technology Key News & Latest Developments
Table 142. IC Package Substrates Capacity of Key Manufacturers in Global Market, 2023-2025 (K Sqm)
Table 143. Global IC Package Substrates Capacity Market Share of Key Manufacturers, 2023-2025
Table 144. Global IC Package Substrates Production by Region, 2020-2025 (K Sqm)
Table 145. Global IC Package Substrates Production by Region, 2026-2031 (K Sqm)
Table 146. IC Package Substrates Market Opportunities & Trends in Global Market
Table 147. IC Package Substrates Market Drivers in Global Market
Table 148. IC Package Substrates Market Restraints in Global Market
Table 149. IC Package Substrates Raw Materials
Table 150. IC Package Substrates Raw Materials Suppliers in Global Market
Table 151. Typical IC Package Substrates Downstream
Table 152. IC Package Substrates Downstream Clients in Global Market
Table 153. IC Package Substrates Distributors and Sales Agents in Global Market

List of Figures
Figure 1. IC Package Substrates Product Picture
Figure 2. IC Package Substrates Segment by Type in 2024
Figure 3. IC Package Substrates Segment by Application in 2024
Figure 4. Global IC Package Substrates Market Overview: 2024
Figure 5. Key Caveats
Figure 6. Global IC Package Substrates Market Size: 2024 VS 2031 (US$, Mn)
Figure 7. Global IC Package Substrates Revenue: 2020-2031 (US$, Mn)
Figure 8. IC Package Substrates Sales in Global Market: 2020-2031 (K Sqm)
Figure 9. The Top 3 and 5 Players Market Share by IC Package Substrates Revenue in 2024
Figure 10. Segment by Type – Global IC Package Substrates Revenue, (US$, Mn), 2024 & 2031
Figure 11. Segment by Type – Global IC Package Substrates Revenue Market Share, 2020-2031
Figure 12. Segment by Type – Global IC Package Substrates Sales Market Share, 2020-2031
Figure 13. Segment by Type – Global IC Package Substrates Price (US$/Sqm), 2020-2031
Figure 14. Segment by Application – Global IC Package Substrates Revenue, (US$, Mn), 2024 & 2031
Figure 15. Segment by Application – Global IC Package Substrates Revenue Market Share, 2020-2031
Figure 16. Segment by Application – Global IC Package Substrates Sales Market Share, 2020-2031
Figure 17. Segment by Application -Global IC Package Substrates Price (US$/Sqm), 2020-2031
Figure 18. By Region – Global IC Package Substrates Revenue, (US$, Mn), 2025 & 2031
Figure 19. By Region – Global IC Package Substrates Revenue Market Share, 2020 VS 2024 VS 2031
Figure 20. By Region – Global IC Package Substrates Revenue Market Share, 2020-2031
Figure 21. By Region – Global IC Package Substrates Sales Market Share, 2020-2031
Figure 22. By Country – North America IC Package Substrates Revenue Market Share, 2020-2031
Figure 23. By Country – North America IC Package Substrates Sales Market Share, 2020-2031
Figure 24. United States IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 25. Canada IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 26. Mexico IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 27. By Country – Europe IC Package Substrates Revenue Market Share, 2020-2031
Figure 28. By Country – Europe IC Package Substrates Sales Market Share, 2020-2031
Figure 29. Germany IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 30. France IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 31. U.K. IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 32. Italy IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 33. Russia IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 34. Nordic Countries IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 35. Benelux IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 36. By Region – Asia IC Package Substrates Revenue Market Share, 2020-2031
Figure 37. By Region – Asia IC Package Substrates Sales Market Share, 2020-2031
Figure 38. China IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 39. Japan IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 40. South Korea IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 41. Southeast Asia IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 42. India IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 43. By Country – South America IC Package Substrates Revenue Market Share, 2020-2031
Figure 44. By Country – South America IC Package Substrates Sales, Market Share, 2020-2031
Figure 45. Brazil IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 46. Argentina IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 47. By Country – Middle East & Africa IC Package Substrates Revenue, Market Share, 2020-2031
Figure 48. By Country – Middle East & Africa IC Package Substrates Sales, Market Share, 2020-2031
Figure 49. Turkey IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 50. Israel IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 51. Saudi Arabia IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 52. UAE IC Package Substrates Revenue, (US$, Mn), 2020-2031
Figure 53. Global IC Package Substrates Production Capacity (K Sqm), 2020-2031
Figure 54. The Percentage of Production IC Package Substrates by Region, 2024 VS 2031
Figure 55. IC Package Substrates Industry Value Chain
Figure 56. Marketing Channels

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