Chip Packaging Market: Emerging Trends, Technological Advancements, and Business Strategies (2023-2029)

The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

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The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

 

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on.

The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

 

Report Attributes Report Details
Report Title Chip Packaging Market: Emerging Trends, Technological Advancements, and Business Strategies (2023-2029)
Market size in 2022 US$ 32050 million
Forecast Market size by 2029 US$ 48900 million
Growth Rate CAGR of 6.2%

 
by Packaging Type
  • Ball Grid Array (BGA)
  • Dual Flat No-Leads (DFN)
  • Dual In-Line Memory Module (DIMM)
  • Quad Flat Package (QFP)
  • Small Outline Package (SOP)
by Type
  • Traditional Packaging
  • Advanced Packaging
by Packaging Material
  • Organic Substrates
  • Ceramic Packages
  • Metal Packages
by Application
  • Automotive and Traffic
  • Consumer Electronics
  • Communication
  • Aerospace and Defense
  • Healthcare
  • Industrial
key players
  • ASE Group
  • Amkor Technology
  • JCET
  • Siliconware Precision Industries
  • STATS ChipPAC Pte. Ltd.
  • Siliconware Precision Industries Co., Ltd
  • Powertech Technology
  • TongFu Microelectronics
  • Tianshui Huatian Technology
  • UTAC
  • Chipbond Technology
  • Hana Micron
  • OSE
  • Walton Advanced Engineering
  • NEPES
  • Unisem
  • ChipMOS
  • Signetics
  • Carsem
  • King Yuan ELECTRONICS
Historical Year 2018 to 2022 (Data from 2010 can be provided as per availability)
Base Year 2022
Forecast Year 2030
Number of Pages 100+ Pages
Customization Available Yes, the report can be customized as per your need.

 

This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging.

This report contains market size and forecasts of Chip Packaging in global, including the following market information:
Global Chip Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)

By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.

The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.

From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.

The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.

We surveyed the Chip Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Chip Packaging Market, by Packaging Type, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Packaging Type, 2022 (%)

  • Ball Grid Array (BGA)
  • Dual Flat No-Leads (DFN)
  • Dual In-Line Memory Module (DIMM)
  • Quad Flat Package (QFP)
  • Small Outline Package (SOP)

Global Chip Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Type, 2022 (%)

  • Traditional Packaging
  • Advanced Packaging

Global Chip Packaging Market, by Packaging Material, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Packaging Material, 2022 (%)

  • Organic Substrates
  • Ceramic Packages
  • Metal Packages

Global Chip Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Application, 2022 (%)

  • Automotive and Traffic
  • Consumer Electronics
  • Communication
  • Aerospace and Defense
  • Healthcare
  • Industrial

Global Chip Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Chip Packaging Market Segment Percentages, By Region and Country, 2022 (%)

  • North America
  • US
  • Canada
  • Mexico
  • Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Nordic Countries
  • Benelux
  • Rest of Europe
  • Asia
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Rest of Asia
  • South America
  • Brazil
  • Argentina
  • Rest of South America
  • Middle East & Africa
  • Turkey
  • Israel
  • Saudi Arabia
  • UAE
  • Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Chip Packaging revenues share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

  • ASE Group
  • Amkor Technology
  • JCET
  • Siliconware Precision Industries
  • STATS ChipPAC Pte. Ltd.
  • Siliconware Precision Industries Co., Ltd
  • Powertech Technology
  • TongFu Microelectronics
  • Tianshui Huatian Technology
  • UTAC
  • Chipbond Technology
  • Hana Micron
  • OSE
  • Walton Advanced Engineering
  • NEPES
  • Unisem
  • ChipMOS
  • Signetics
  • Carsem
  • King Yuan ELECTRONICS

Market Drivers:

  1. Increasing demand for consumer electronics: The growing popularity of smartphones, tablets, wearables, and other consumer electronics is driving the demand for more advanced and efficient chip packaging solutions.
  2. Advancements in chip technology: As semiconductor technology continues to evolve, new packaging solutions are needed to meet the performance requirements of advanced chips, such as high-speed processors and memory chips.
  3. Rising demand for miniaturization: With the trend towards smaller and more portable devices, there is a growing need for smaller and more compact chip packages that can be integrated into these devices without taking up too much space.
  4. Increasing focus on energy efficiency: With the rising cost of energy and concerns about the environment, there is a growing demand for energy-efficient chip packages that can help to reduce power consumption and extend battery life.
  5. Growing demand for automation and IoT: As automation and the Internet of Things (IoT) continue to gain momentum, there is an increasing need for chips that can support these applications, which is driving demand for advanced chip packaging solutions.
  6. Emergence of new packaging technologies: The chip packaging market is also being driven by the emergence of new packaging technologies, such as 3D packaging, wafer-level packaging, and fan-out wafer-level packaging, which offer new capabilities and advantages over traditional packaging methods.

Restraining Factors:

  1. High development and production costs: Developing and producing advanced chip packaging solutions can be costly, which can make it difficult for some companies to invest in new packaging technologies.
  2. Technical challenges: There are various technical challenges associated with advanced chip packaging, such as thermal management, electrical performance, and reliability issues, which can make it difficult to develop and manufacture high-quality packages.
  3. Increasing competition: The chip packaging market is highly competitive, with many companies offering similar products and services. This can make it difficult for companies to differentiate themselves and maintain market share.
  4. Complex supply chain: The chip packaging market has a complex supply chain that involves multiple suppliers, manufacturers, and distributors. This can create logistical challenges and increase the risk of supply chain disruptions.
  5. Regulatory challenges: The chip packaging market is subject to various regulations and standards, which can create compliance challenges for companies operating in the industry.

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Table of Content

1 Introduction to Research & Analysis Reports
 1.1 Chip Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global Chip Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Chip Packaging Overall Market Size
 2.1 Global Chip Packaging Market Size: 2022 VS 2029
2.2 Global Chip Packaging Market Size, Prospects & Forecasts: 2018-2029
2.3 Key Market Trends, Opportunity, Drivers and Restraints
2.3.1 Market Opportunities & Trends
2.3.2 Market Drivers
2.3.3 Market Restraints
3 Company Landscape
 3.1 Top Chip Packaging Players in Global Market
3.2 Top Global Chip Packaging Companies Ranked by Revenue
3.3 Global Chip Packaging Revenue by Companies
3.4 Top 3 and Top 5 Chip Packaging Companies in Global Market, by Revenue in 2022
3.5 Global Companies Chip Packaging Product Type
3.6 Tier 1, Tier 2 and Tier 3 Chip Packaging Players in Global Market
3.6.1 List of Global Tier 1 Chip Packaging Companies
3.6.2 List of Global Tier 2 and Tier 3 Chip Packaging Companies
4 Market Sights by Product
 4.1 Overview
4.1.1 By Type – Global Chip Packaging Market Size Markets, 2022 & 2029
4.1.2 Traditional Packaging
4.1.3 Advanced Packaging
4.2 By Type – Global Chip Packaging Revenue & Forecasts
4.2.1 By Type – Global Chip Packaging Revenue, 2018-2023
4.2.2 By Type – Global Chip Packaging Revenue, 2024-2029
4.2.3 By Type – Global Chip Packaging Revenue Market Share, 2018-2029
5 Sights by Application
 5.1 Overview
5.1.1 By Application – Global Chip Packaging Market Size, 2022 & 2029
5.1.2 Automotive and Traffic
5.1.3 Consumer Electronics
5.1.4 Communication
5.1.5 Other
5.2 By Application – Global Chip Packaging Revenue & Forecasts
5.2.1 By Application – Global Chip Packaging Revenue, 2018-2023
5.2.2 By Application – Global Chip Packaging Revenue, 2024-2029
5.2.3 By Application – Global Chip Packaging Revenue Market Share, 2018-2029
6 Sights by Region
 6.1 By Region – Global Chip Packaging Market Size, 2022 & 2029
6.2 By Region – Global Chip Packaging Revenue & Forecasts
6.2.1 By Region – Global Chip Packaging Revenue, 2018-2023
6.2.2 By Region – Global Chip Packaging Revenue, 2024-2029
6.2.3 By Region – Global Chip Packaging Revenue Market Share, 2018-2029
6.3 North America
6.3.1 By Country – North America Chip Packaging Revenue, 2018-2029
6.3.2 US Chip Packaging Market Size, 2018-2029
6.3.3 Canada Chip Packaging Market Size, 2018-2029
6.3.4 Mexico Chip Packaging Market Size, 2018-2029
6.4 Europe
6.4.1 By Country – Europe Chip Packaging Revenue, 2018-2029
6.4.2 Germany Chip Packaging Market Size, 2018-2029
6.4.3 France Chip Packaging Market Size, 2018-2029
6.4.4 U.K. Chip Packaging Market Size, 2018-2029
6.4.5 Italy Chip Packaging Market Size, 2018-2029
6.4.6 Russia Chip Packaging Market Size, 2018-2029
6.4.7 Nordic Countries Chip Packaging Market Size, 2018-2029
6.4.8 Benelux Chip Packaging Market Size, 2018-2029
6.5 Asia
6.5.1 By Region – Asia Chip Packaging Revenue, 2018-2029
6.5.2 China Chip Packaging Market Size, 2018-2029
6.5.3 Japan Chip Packaging Market Size, 2018-2029
6.5.4 South Korea Chip Packaging Market Size, 2018-2029
6.5.5 Southeast Asia Chip Packaging Market Size, 2018-2029
6.5.6 India Chip Packaging Market Size, 2018-2029
6.6 South America
6.6.1 By Country – South America Chip Packaging Revenue, 2018-2029
6.6.2 Brazil Chip Packaging Market Size, 2018-2029
6.6.3 Argentina Chip Packaging Market Size, 2018-2029
6.7 Middle East & Africa
6.7.1 By Country – Middle East & Africa Chip Packaging Revenue, 2018-2029
6.7.2 Turkey Chip Packaging Market Size, 2018-2029
6.7.3 Israel Chip Packaging Market Size, 2018-2029
6.7.4 Saudi Arabia Chip Packaging Market Size, 2018-2029
6.7.5 UAE Chip Packaging Market Size, 2018-2029
7 Chip Packaging Companies Profiles
 7.1 ASE Group
7.1.1 ASE Group Company Summary
7.1.2 ASE Group Business Overview
7.1.3 ASE Group Chip Packaging Major Product Offerings
7.1.4 ASE Group Chip Packaging Revenue in Global Market (2018-2023)
7.1.5 ASE Group Key News & Latest Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Company Summary
7.2.2 Amkor Technology Business Overview
7.2.3 Amkor Technology Chip Packaging Major Product Offerings
7.2.4 Amkor Technology Chip Packaging Revenue in Global Market (2018-2023)
7.2.5 Amkor Technology Key News & Latest Developments
7.3 JCET
7.3.1 JCET Company Summary
7.3.2 JCET Business Overview
7.3.3 JCET Chip Packaging Major Product Offerings
7.3.4 JCET Chip Packaging Revenue in Global Market (2018-2023)
7.3.5 JCET Key News & Latest Developments
7.4 Siliconware Precision Industries
7.4.1 Siliconware Precision Industries Company Summary
7.4.2 Siliconware Precision Industries Business Overview
7.4.3 Siliconware Precision Industries Chip Packaging Major Product Offerings
7.4.4 Siliconware Precision Industries Chip Packaging Revenue in Global Market (2018-2023)
7.4.5 Siliconware Precision Industries Key News & Latest Developments
7.5 Powertech Technology
7.5.1 Powertech Technology Company Summary
7.5.2 Powertech Technology Business Overview
7.5.3 Powertech Technology Chip Packaging Major Product Offerings
7.5.4 Powertech Technology Chip Packaging Revenue in Global Market (2018-2023)
7.5.5 Powertech Technology Key News & Latest Developments
7.6 TongFu Microelectronics
7.6.1 TongFu Microelectronics Company Summary
7.6.2 TongFu Microelectronics Business Overview
7.6.3 TongFu Microelectronics Chip Packaging Major Product Offerings
7.6.4 TongFu Microelectronics Chip Packaging Revenue in Global Market (2018-2023)
7.6.5 TongFu Microelectronics Key News & Latest Developments
7.7 Tianshui Huatian Technology
7.7.1 Tianshui Huatian Technology Company Summary
7.7.2 Tianshui Huatian Technology Business Overview
7.7.3 Tianshui Huatian Technology Chip Packaging Major Product Offerings
7.7.4 Tianshui Huatian Technology Chip Packaging Revenue in Global Market (2018-2023)
7.7.5 Tianshui Huatian Technology Key News & Latest Developments
7.8 UTAC
7.8.1 UTAC Company Summary
7.8.2 UTAC Business Overview
7.8.3 UTAC Chip Packaging Major Product Offerings
7.8.4 UTAC Chip Packaging Revenue in Global Market (2018-2023)
7.8.5 UTAC Key News & Latest Developments
7.9 Chipbond Technology
7.9.1 Chipbond Technology Company Summary
7.9.2 Chipbond Technology Business Overview
7.9.3 Chipbond Technology Chip Packaging Major Product Offerings
7.9.4 Chipbond Technology Chip Packaging Revenue in Global Market (2018-2023)
7.9.5 Chipbond Technology Key News & Latest Developments
7.10 Hana Micron
7.10.1 Hana Micron Company Summary
7.10.2 Hana Micron Business Overview
7.10.3 Hana Micron Chip Packaging Major Product Offerings
7.10.4 Hana Micron Chip Packaging Revenue in Global Market (2018-2023)
7.10.5 Hana Micron Key News & Latest Developments
7.11 OSE
7.11.1 OSE Company Summary
7.11.2 OSE Business Overview
7.11.3 OSE Chip Packaging Major Product Offerings
7.11.4 OSE Chip Packaging Revenue in Global Market (2018-2023)
7.11.5 OSE Key News & Latest Developments
7.12 Walton Advanced Engineering
7.12.1 Walton Advanced Engineering Company Summary
7.12.2 Walton Advanced Engineering Business Overview
7.12.3 Walton Advanced Engineering Chip Packaging Major Product Offerings
7.12.4 Walton Advanced Engineering Chip Packaging Revenue in Global Market (2018-2023)
7.12.5 Walton Advanced Engineering Key News & Latest Developments
7.13 NEPES
7.13.1 NEPES Company Summary
7.13.2 NEPES Business Overview
7.13.3 NEPES Chip Packaging Major Product Offerings
7.13.4 NEPES Chip Packaging Revenue in Global Market (2018-2023)
7.13.5 NEPES Key News & Latest Developments
7.14 Unisem
7.14.1 Unisem Company Summary
7.14.2 Unisem Business Overview
7.14.3 Unisem Chip Packaging Major Product Offerings
7.14.4 Unisem Chip Packaging Revenue in Global Market (2018-2023)
7.14.5 Unisem Key News & Latest Developments
7.15 ChipMOS
7.15.1 ChipMOS Company Summary
7.15.2 ChipMOS Business Overview
7.15.3 ChipMOS Chip Packaging Major Product Offerings
7.15.4 ChipMOS Chip Packaging Revenue in Global Market (2018-2023)
7.15.5 ChipMOS Key News & Latest Developments
7.16 Signetics
7.16.1 Signetics Company Summary
7.16.2 Signetics Business Overview
7.16.3 Signetics Chip Packaging Major Product Offerings
7.16.4 Signetics Chip Packaging Revenue in Global Market (2018-2023)
7.16.5 Signetics Key News & Latest Developments
7.17 Carsem
7.17.1 Carsem Company Summary
7.17.2 Carsem Business Overview
7.17.3 Carsem Chip Packaging Major Product Offerings
7.17.4 Carsem Chip Packaging Revenue in Global Market (2018-2023)
7.17.5 Carsem Key News & Latest Developments
7.18 King Yuan ELECTRONICS
7.18.1 King Yuan ELECTRONICS Company Summary
7.18.2 King Yuan ELECTRONICS Business Overview
7.18.3 King Yuan ELECTRONICS Chip Packaging Major Product Offerings
7.18.4 King Yuan ELECTRONICS Chip Packaging Revenue in Global Market (2018-2023)
7.18.5 King Yuan ELECTRONICS Key News & Latest Developments
8 Conclusion
 9 Appendix
 9.1 Note
9.2 Examples of Clients
9.3 Disclaimer

List of Tables
Table 1. Chip Packaging Market Opportunities & Trends in Global Market
Table 2. Chip Packaging Market Drivers in Global Market
Table 3. Chip Packaging Market Restraints in Global Market
Table 4. Key Players of Chip Packaging in Global Market
Table 5. Top Chip Packaging Players in Global Market, Ranking by Revenue (2022)
Table 6. Global Chip Packaging Revenue by Companies, (US$, Mn), 2018-2023
Table 7. Global Chip Packaging Revenue Share by Companies, 2018-2023
Table 8. Global Companies Chip Packaging Product Type
Table 9. List of Global Tier 1 Chip Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 10. List of Global Tier 2 and Tier 3 Chip Packaging Companies, Revenue (US$, Mn) in 2022 and Market Share
Table 11. By Type ? Global Chip Packaging Revenue, (US$, Mn), 2022 & 2029
Table 12. By Type – Chip Packaging Revenue in Global (US$, Mn), 2018-2023
Table 13. By Type – Chip Packaging Revenue in Global (US$, Mn), 2024-2029
Table 14. By Application ? Global Chip Packaging Revenue, (US$, Mn), 2022 & 2029
Table 15. By Application – Chip Packaging Revenue in Global (US$, Mn), 2018-2023
Table 16. By Application – Chip Packaging Revenue in Global (US$, Mn), 2024-2029
Table 17. By Region ? Global Chip Packaging Revenue, (US$, Mn), 2022 & 2029
Table 18. By Region – Global Chip Packaging Revenue (US$, Mn), 2018-2023
Table 19. By Region – Global Chip Packaging Revenue (US$, Mn), 2024-2029
Table 20. By Country – North America Chip Packaging Revenue, (US$, Mn), 2018-2023
Table 21. By Country – North America Chip Packaging Revenue, (US$, Mn), 2024-2029
Table 22. By Country – Europe Chip Packaging Revenue, (US$, Mn), 2018-2023
Table 23. By Country – Europe Chip Packaging Revenue, (US$, Mn), 2024-2029
Table 24. By Region – Asia Chip Packaging Revenue, (US$, Mn), 2018-2023
Table 25. By Region – Asia Chip Packaging Revenue, (US$, Mn), 2024-2029
Table 26. By Country – South America Chip Packaging Revenue, (US$, Mn), 2018-2023
Table 27. By Country – South America Chip Packaging Revenue, (US$, Mn), 2024-2029
Table 28. By Country – Middle East & Africa Chip Packaging Revenue, (US$, Mn), 2018-2023
Table 29. By Country – Middle East & Africa Chip Packaging Revenue, (US$, Mn), 2024-2029
Table 30. ASE Group Company Summary
Table 31. ASE Group Chip Packaging Product Offerings
Table 32. ASE Group Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 33. ASE Group Key News & Latest Developments
Table 34. Amkor Technology Company Summary
Table 35. Amkor Technology Chip Packaging Product Offerings
Table 36. Amkor Technology Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 37. Amkor Technology Key News & Latest Developments
Table 38. JCET Company Summary
Table 39. JCET Chip Packaging Product Offerings
Table 40. JCET Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 41. JCET Key News & Latest Developments
Table 42. Siliconware Precision Industries Company Summary
Table 43. Siliconware Precision Industries Chip Packaging Product Offerings
Table 44. Siliconware Precision Industries Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 45. Siliconware Precision Industries Key News & Latest Developments
Table 46. Powertech Technology Company Summary
Table 47. Powertech Technology Chip Packaging Product Offerings
Table 48. Powertech Technology Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 49. Powertech Technology Key News & Latest Developments
Table 50. TongFu Microelectronics Company Summary
Table 51. TongFu Microelectronics Chip Packaging Product Offerings
Table 52. TongFu Microelectronics Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 53. TongFu Microelectronics Key News & Latest Developments
Table 54. Tianshui Huatian Technology Company Summary
Table 55. Tianshui Huatian Technology Chip Packaging Product Offerings
Table 56. Tianshui Huatian Technology Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 57. Tianshui Huatian Technology Key News & Latest Developments
Table 58. UTAC Company Summary
Table 59. UTAC Chip Packaging Product Offerings
Table 60. UTAC Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 61. UTAC Key News & Latest Developments
Table 62. Chipbond Technology Company Summary
Table 63. Chipbond Technology Chip Packaging Product Offerings
Table 64. Chipbond Technology Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 65. Chipbond Technology Key News & Latest Developments
Table 66. Hana Micron Company Summary
Table 67. Hana Micron Chip Packaging Product Offerings
Table 68. Hana Micron Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 69. Hana Micron Key News & Latest Developments
Table 70. OSE Company Summary
Table 71. OSE Chip Packaging Product Offerings
Table 72. OSE Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 73. OSE Key News & Latest Developments
Table 74. Walton Advanced Engineering Company Summary
Table 75. Walton Advanced Engineering Chip Packaging Product Offerings
Table 76. Walton Advanced Engineering Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 77. Walton Advanced Engineering Key News & Latest Developments
Table 78. NEPES Company Summary
Table 79. NEPES Chip Packaging Product Offerings
Table 80. NEPES Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 81. NEPES Key News & Latest Developments
Table 82. Unisem Company Summary
Table 83. Unisem Chip Packaging Product Offerings
Table 84. Unisem Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 85. Unisem Key News & Latest Developments
Table 86. ChipMOS Company Summary
Table 87. ChipMOS Chip Packaging Product Offerings
Table 88. ChipMOS Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 89. ChipMOS Key News & Latest Developments
Table 90. Signetics Company Summary
Table 91. Signetics Chip Packaging Product Offerings
Table 92. Signetics Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 93. Signetics Key News & Latest Developments
Table 94. Carsem Company Summary
Table 95. Carsem Chip Packaging Product Offerings
Table 96. Carsem Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 97. Carsem Key News & Latest Developments
Table 98. King Yuan ELECTRONICS Company Summary
Table 99. King Yuan ELECTRONICS Chip Packaging Product Offerings
Table 100. King Yuan ELECTRONICS Chip Packaging Revenue (US$, Mn) & (2018-2023)
Table 101. King Yuan ELECTRONICS Key News & Latest Developments
List of Figures
Figure 1. Chip Packaging Segment by Type in 2022
Figure 2. Chip Packaging Segment by Application in 2022
Figure 3. Global Chip Packaging Market Overview: 2022
Figure 4. Key Caveats
Figure 5. Global Chip Packaging Market Size: 2022 VS 2029 (US$, Mn)
Figure 6. Global Chip Packaging Revenue, 2018-2029 (US$, Mn)
Figure 7. The Top 3 and 5 Players Market Share by Chip Packaging Revenue in 2022
Figure 8. By Type – Global Chip Packaging Revenue Market Share, 2018-2029
Figure 9. By Application – Global Chip Packaging Revenue Market Share, 2018-2029
Figure 10. By Type – Global Chip Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 11. By Type – Global Chip Packaging Revenue Market Share, 2018-2029
Figure 12. By Application – Global Chip Packaging Revenue, (US$, Mn), 2022 & 2029
Figure 13. By Application – Global Chip Packaging Revenue Market Share, 2018-2029
Figure 14. By Region – Global Chip Packaging Revenue Market Share, 2018-2029
Figure 15. By Country – North America Chip Packaging Revenue Market Share, 2018-2029
Figure 16. US Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 17. Canada Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 18. Mexico Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 19. By Country – Europe Chip Packaging Revenue Market Share, 2018-2029
Figure 20. Germany Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 21. France Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 22. U.K. Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 23. Italy Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 24. Russia Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 25. Nordic Countries Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 26. Benelux Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 27. By Region – Asia Chip Packaging Revenue Market Share, 2018-2029
Figure 28. China Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 29. Japan Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 30. South Korea Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 31. Southeast Asia Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 32. India Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 33. By Country – South America Chip Packaging Revenue Market Share, 2018-2029
Figure 34. Brazil Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 35. Argentina Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 36. By Country – Middle East & Africa Chip Packaging Revenue Market Share, 2018-2029
Figure 37. Turkey Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 38. Israel Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 39. Saudi Arabia Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 40. UAE Chip Packaging Revenue, (US$, Mn), 2018-2029
Figure 41. ASE Group Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 42. Amkor Technology Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 43. JCET Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 44. Siliconware Precision Industries Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 45. Powertech Technology Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 46. TongFu Microelectronics Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 47. Tianshui Huatian Technology Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 48. UTAC Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 49. Chipbond Technology Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 50. Hana Micron Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 51. OSE Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 52. Walton Advanced Engineering Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 53. NEPES Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 54. Unisem Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 55. ChipMOS Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 56. Signetics Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 57. Carsem Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)
Figure 58. King Yuan ELECTRONICS Chip Packaging Revenue Year Over Year Growth (US$, Mn) & (2018-2023)

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