India 3D IC and 2.5D IC packaging market was valued at USD 2,373.5 million in 2026 and is projected to reach USD 10,004.7 million by 2036, registering a CAGR of 15.5% during 2027–2036. West India holds an estimated ~44% of 2026 revenue, reflecting Gujarat’s expanding assembly, test and wafer-fabrication pipeline; however, the commercial scope is limited to advanced multi-die packaging rather than all domestic semiconductor output.