Chip trays form a core handling medium in semiconductor operations. These precision molded carriers hold individual integrated circuit packages, bare dies, or related components in fixed pockets arranged in a matrix.

They protect devices from mechanical damage, electrostatic discharge, and contamination while enabling reliable transfer between process steps, testing stations, baking ovens, and shipping containers.

Daewon – The Korean Trailblazer

• Daewon, founded in 1975, pioneered IC shipping trays in Korea during the 1990s and has grown into a recognized global force for JEDEC-compliant trays serving the full semiconductor chain.
• Its portfolio spans IC trays, process cassettes, wafer media, film-frame shippers, and bare-die tapes produced through advanced plastic extrusion and injection molding.
• The company supports solar, biomedical, and multiple semiconductor segments with open-tool designs that cover a wide matrix of package types.
• In recent years it has continued refining precision molding and automated processes to meet evolving customer needs for high-volume, ESD-safe handling. Daewon’s long track record of “do it right the first time” manufacturing keeps it central to reliable tray supply for IDMs and OSATs worldwide.

Kostat – The Versatile Protector

Kostat designs and supplies IC trays and thermoformed trays that shield memory and non-memory packages from static, EMI, heat, and physical stress throughout front-end and logistics stages. Its trays accommodate dozens of package styles including QFN, QFP, BGA, CSP, LGA, SIP, and modules, with heat-resistance options up to 260 °C and materials such as MPPO, PSU, PES, and PEEK.

Surface resistance can be tailored across conductive to dissipative ranges, and warpage is controlled tightly. Thermoformed versions reach sheet thicknesses from 0.3 mm to 4.0 mm and maximum sizes of 960 × 1,000 mm. Kostat serves major Korean and global IDMs and OSATs for smartphone, automotive, and display applications, emphasizing custom designs beyond standard JEDEC outlines.

Sunrise – The Taiwan Precision Builder

Sunrise Plastics Industry, established in 1991 and headquartered in Taichung, Taiwan, operates manufacturing sites in Taiwan and Kunshan, China, producing JEDEC trays, memory-card mechanisms, and USB plastic parts. The Taiwan facility covers roughly 8,600 m² with around 380 employees, while the Kunshan site spans about 16,666 m² with roughly 400 people.

The company maintains a broad mold library for QFP, TSOP, BGA, QFN, LGA, module, and custom trays, serving OSATs, foundries, ODMs, and fabless firms across Asia and beyond. Sunrise holds multiple ISO certifications and continues to expand capacity to support high-volume automated handling demands in 2025-2026.

To find out more, feel free to browse our latest updated report: https://semiconductorinsight.com/report/chip-trays-market/

Peak International – The Matrix Specialist

• Peak International focuses on matrix trays used in automated test and assembly, offering JEDEC-standard and custom designs for BGA, QFN, QFP, LQFP, TSOP, and PGA packages.
• Its UltraLite and recycled-tray options reduce weight and freight costs while maintaining structural strength and precise pocket pitching.
• The company has decades of experience supplying the world’s largest semiconductor makers with innovative features such as double-slope walls and modular inserts.
• Peak’s design and tooling expertise allows rapid response to new package footprints, supporting efficient high-speed SMT and test equipment interfaces.

SHINON – The Open-Tray Expert

SHINON Corporation, founded in 1983 in Tokyo, maintains more than 600 open-tray designs one of the broader selections in the industry plus custom options and IC substrate cleaning trays. The company also supplies moisture-barrier bags and works with major customers including AMD, Nanya, NVIDIA, SPIL, ASE, and TSMC.

With facilities in Tokyo and Gunma and affiliated operations in Taiwan, Shanghai, and Malaysia, SHINON emphasizes quick turnaround on open tools and thousands of accumulated design experiences. Its JEDEC-compliant trays continue to support high-volume packaging and test lines.

Mishima Kosan – Japan’s Integrated Capacity Leader

Mishima Kosan provides a complete one-stop service from conductive resin-composite pellet production through tray design, mold making, and molding. Combined monthly capacity in Japan and overseas reaches 2 million pieces, giving the company the leading position in the Japanese market with more than 40 % share.

Materials include PPE+CP, PC+CP, and PSU+CF tailored for heat resistance, appearance, or rigidity. Major customers include Renesas, Sony Semiconductor, and Amkor Japan. The integrated system supports both standard and high-performance trays used in transport and heat-treatment steps of semiconductor manufacturing.

HWA SHU – The Mold-Library Powerhouse

• Hwa Shu Enterprise, founded in 1982 in Kaohsiung, Taiwan, entered IC-tray production in 1992 and has built more than 1,000 IC-tray molds plus over 600 carrier-tape molds and more than 400 chip-tray molds.
• The company operates multiple factories and maintains service offices in Singapore and Japan, supplying trays, tape & reel, and chip trays to customers across Taiwan, China, Japan, Korea, and Southeast Asia.
• Its product range covers general and COG trays, supporting the full packaging-and-test supply chain with continuous capacity expansions.

ASE Group – The Packaging Giant’s Handling Arm

As the world’s leading OSAT, ASE integrates tray usage deeply into its advanced packaging operations, including the VIPack platform and new automated 310 mm × 310 mm panel-level packaging lines announced for production ramp in 2027. In 2026 ASE raised capital expenditure plans substantially (reaching multi-billion-dollar levels) and launched multiple new facilities, including a fifth plant in Penang and major Kaohsiung projects, while advancing co-packaged optics.

These expansions drive high demand for precision trays that protect AI, HPC, and advanced packages through testing and shipping. ASE’s scale makes it both a major user and an influential force in tray specifications.

TOMOE Engineering – The Full-Range Supplier

TOMOE Engineering supplies a complete lineup of IC trays for QFP, BGA, TSOP, and related packages, covering bake temperatures from 60 °C to 180 °C (and higher in selected materials). All trays conform to JEDEC standards as open designs, with no initial mold charge and just-in-time delivery options. The company acts as a convenient “department store” of trays sourced and distributed to meet diverse user requirements across testing, carrying, and shipping stages.

ITW ECPS – The Durable Lightweight Innovator

ITW ECPS develops JEDEC trays that balance maximum durability with reduced weight, incorporating proprietary design techniques for structural strength and precise pocket pitching critical for small devices. Features include poka-yoke elements that prevent misplacement and a breakthrough 2.5 × 2.5 mm LGA flippable tray.

Materials are selected for a wide range of operating temperatures, and the company maintains rigorous testing including 3D CMM, ESD, and reliability labs. Re-used trays from major manufacturers are also offered, supporting cost-efficient high-cycle applications.

Entegris – The Catalog and Customization Leader

Entegris maintains a catalog of over 16,000 existing tray designs for substrates, small packages, and waffle trays, with custom trays deliverable in as little as two weeks. Products include H20/H44 series 2-inch and 4-inch trays, ChipSentry materials, and specialized handling solutions used far beyond semiconductors into medical and other precision industries.

In late 2025 the company opened a 135,000-square-foot Manufacturing Center of Excellence in Colorado Springs, reshoring production of wafer carriers (FOUPs) previously made outside the U.S. for decades and supporting customers such as Intel, TSMC, and Samsung. The site strengthens domestic supply resilience for critical process solutions.

ePAK – The Full-Spectrum Packaging Partner

Founded in 1999, ePAK designs and manufactures more than 5,000 products serving over 500 customers across front-end wafer handling, back-end IC transport, and sub-assembly stages. Manufacturing sites in Shenzhen, Anhui (China), and Penang (Malaysia) produce matrix trays (JEDEC, EIAJ, and custom), carrier tape, and related media with patented features such as eBIN lot identification and V-Cut designs. The company’s modular insert-tray systems and ESD-safe materials support high-speed automated assembly and SMT equipment for semiconductor, OEM, and test-house customers.

RH Murphy Company – The Flippable-Tray Pioneer

• RH Murphy Co. invented flippable BGA trays and ISOPAK carriers and remains a specialist in JEDEC matrix trays, custom waffle packs, and ESD-safe handling solutions.
• Its NoStat polymers and application-specific designs serve semiconductor packages (PGA, QFP, BGA, QFN, LGA, etc.) as well as optical, photonic, and mechanical parts.
• Trays conform to JEDEC outline dimensions (approximately 315 mm × 135.9 mm) with controlled flatness, and the company supports both open-tooled and custom molds for prototype through high-volume needs.
• RH Murphy’s focus on problem-solving plastics engineering keeps it relevant for automated environments.

Shin-Etsu Polymer – The Materials Precision House

As part of the Shin-Etsu group, Shin-Etsu Polymer supplies precision plastic packaging and carrier materials that protect wafers and devices from particle contamination. Its portfolio includes wafer cases, embossed carrier tape, chip fixture plates (KSB/HSB series), and related trays engineered with advanced compounding and micro-perforation technology.

These products support electrode processes, component holding, and automated mounting across a wide size range, leveraging the group’s materials expertise for dimensional accuracy and anti-static performance.

Hiner Advanced Materials – The Rising Custom Contender

Hiner (often referenced as Shenzhen Hiner Technology or Hiner Advanced Materials) has emerged as an active supplier of specialized IC trays and packaging materials within the expanding Chinese and global semiconductor ecosystem. It appears regularly among key players supporting advanced package handling needs driven by AI and high-performance computing growth.

The company focuses on high-performance plastics and custom solutions that complement the broader tray supply chain serving OSATs and device makers. Its inclusion reflects the increasing geographic diversification of tray manufacturing capacity in recent years.