Silicon Box has announced its participation in imec’s Automotive Chiplet Program (ACP), a collaborative initiative focused on accelerating chiplet adoption for next-generation vehicles. The move reflects the growing importance of advanced semiconductor packaging in addressing the rising compute demands of software-defined and autonomous-ready automotive systems.

• Chiplet technology is increasingly seen as a practical path forward for the automotive industry, offering greater flexibility, improved scalability, and the potential to reduce development costs and time-to-market. Through its involvement in the ACP, Silicon Box will contribute its expertise in chiplet interconnection, advanced packaging, and testing to support research around interoperability, reliability, and automotive-grade performance.
• According to BJ Han, co-founder and CEO of Silicon Box, “the ACP is a huge step forward for the rapidly growing chiplet ecosystem because it means that the automotive industry, a key pillar of European industrial strength, has recognised the benefits of chiplet technology and is making a commitment to accelerate development and adoption at scale”.

Silicon Box has also been building momentum in the automotive segment. The company recently received an IATF 16949 Letter of Conformance for automotive-grade packaging solutions and reported strong revenue growth from automotive customers in the first quarter of 2026. Its broader expansion strategy includes a planned second facility in Novara, Italy, which is expected to further support its advanced packaging capabilities in Europe.

As automotive electronics continue to evolve, partnerships like this highlight the industry’s shift toward modular, high-performance semiconductor architectures that can support the next phase of mobility innovation.

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