The global electronics industry continues to evolve rapidly, driven by the demand for lighter, smaller, and more reliable devices. Among the critical innovations shaping this landscape, rigid-flex printed circuit boards (PCBs) have emerged as a vital technology, combining the durability of rigid boards with the flexibility of flex circuits. These hybrid solutions are increasingly used in aerospace, medical devices, consumer electronics, automotive systems, and defense applications.

In 2024, the Rigid-Flex Boards Market was valued at US$ 2.8 billion. With a steady demand across industries, the market is projected to grow at a CAGR of 7.1% from 2025 to 2032, reaching US$ 4.9 billion by 2032. This growth is fueled by innovations in design and materials, strategic partnerships, digital transformation in procurement, and technological advancements in manufacturing.

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Market Overview

Rigid-flex PCBs are engineered to integrate rigid and flexible circuit technologies into a unified structure. This design eliminates the need for connectors and cables, reduces assembly complexity, and enhances product durability. Key industries utilizing these boards include:

• Aerospace & Defense: For lightweight, durable, and vibration-resistant components.
• Consumer Electronics: Smartphones, tablets, and wearables benefit from compact and flexible designs.
• Medical Devices: High-reliability circuits in compact medical diagnostic tools and implants.
• Automotive: Increasing use in advanced driver-assistance systems (ADAS), infotainment systems, and EV battery management.

The expansion of these end-use industries underscores why the rigid-flex market is witnessing robust growth.

Recent Developments in the Rigid-Flex Boards Industry

1. OKI Circuit Technology (OTC) Introduces Space-Grade Rigid-Flex PCBs

One of the most significant recent developments comes from OKI Circuit Technology (OTC), which has launched rigid-flex PCBs with embedded copper coins. These boards are designed for applications in satellites and rockets, where managing heat in a vacuum environment is a major challenge. Traditional thermal solutions are less effective in space, but the embedded copper coins provide superior thermal dissipation.

Key Benefits:

• Enhanced thermal conductivity for space electronics.
• Reduction in connectors, saving weight and improving reliability.
• Commercial rollout in August 2025 with an annual sales target of ¥20 million for FY2026.

This innovation represents a major step forward in aerospace electronics, offering a solution that balances performance with size and weight efficiency.

2. Epec Engineered Technologies: Online Ordering of Rigid-Flex PCBs

Digital transformation is reshaping the PCB procurement process. In 2025, Epec Engineered Technologies introduced online quote and ordering functionality for rigid-flex PCBs through its InstantPCBQuote platform. This move is particularly impactful because rigid-flex boards require customized designs, often involving complex material combinations and stiffeners.

Advantages of Online Ordering:

• Greater customer control over design parameters.
• Time savings in the procurement cycle.
• Enhanced transparency and faster delivery.

This reflects a broader industry trend toward digital platforms that simplify engineering processes and empower customers with greater flexibility.

3. Epec & Roca Printed Circuits: Expanding Strategic Collaboration

On April 28, 2025, Epec expanded its partnership with Roca Printed Circuits, integrating Roca into its NetVia Group PCB division in Dallas. This strategic collaboration strengthens Epec’s portfolio, particularly in rigid-flex and specialty PCB solutions.

Implications:

• Expanded manufacturing capacity and capabilities.
• Stronger presence in the U.S. market.
• Enhanced ability to serve industries requiring customized rigid-flex solutions.

Such partnerships highlight the industry’s consolidation trend, where companies combine expertise and resources to remain competitive.

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4. Polymatech Expands Rigid-Flex Capabilities in Europe

Another major development is Polymatech’s new 10,000 sq ft PCB facility in Estonia. This expansion represents a strategic push into the European market, enhancing local manufacturing capacity for rigid-flex boards and related solutions.

Impact of Expansion:

• Supports growing demand in Europe for high-performance PCBs.
• Enhances supply chain resilience by reducing dependence on imports.
• Boosts regional innovation in advanced electronics manufacturing.

This move aligns with Europe’s broader efforts to strengthen its semiconductor and electronics supply chain.

5. Industry Showcases at IMS 2025

The International Microwave Symposium (IMS) 2025 will feature leading PCB manufacturers, including Amphenol Printed Circuits and American Standard Circuits (ASC) with Sunstone Circuits, showcasing rigid-flex solutions tailored for high-frequency and high-speed applications.

Significance:

• Showcases growing interest in rigid-flex for RF and microwave applications.
• Highlights advancements in signal integrity, miniaturization, and design flexibility.
• Reflects the increasing integration of rigid-flex technology in next-gen wireless and IoT systems.

These exhibitions demonstrate the importance of trade shows in unveiling new solutions and connecting innovators with potential clients.

6. Advances in Rigid-Flex Manufacturing Technologies

Alongside corporate developments, new manufacturing methods are redefining how rigid-flex boards are produced:

• Laser Drilling: Enables higher precision for microvias, essential for HDI (High-Density Interconnect) boards.
• AI-Powered Design Tools: Accelerates design processes and improves error detection.
• 3D Printing for Prototyping: Reduces costs and shortens development cycles.
• Eco-Friendly Processes: Manufacturers are adopting greener techniques, reducing chemical waste and improving recyclability.

These advancements enhance the scalability and cost-effectiveness of rigid-flex manufacturing, supporting industry growth.

Market Growth Drivers

Several factors are fueling the growth of the rigid-flex PCB market:

1. Miniaturization Trends: The demand for smaller, lighter devices drives the adoption of rigid-flex solutions.
2. Reliability Needs: Industries like aerospace, automotive, and medical devices require robust circuits resistant to shock, vibration, and temperature variations.
3. Automotive Electrification: EVs and ADAS systems require complex PCBs with higher reliability.
4. Healthcare Innovation: Wearables and implantable medical devices benefit from compact, flexible designs.
5. Defense Applications: Governments worldwide are investing in ruggedized, high-performance electronic systems.

Challenges in the Rigid-Flex PCB Market

Despite strong growth, the industry faces challenges:

• High Manufacturing Costs: The complexity of rigid-flex boards raises production costs.
• Design Complexity: Integrating rigid and flexible sections requires specialized expertise.
• Supply Chain Disruptions: Geopolitical factors and material shortages can hinder production.
• Testing Requirements: Ensuring quality and reliability requires extensive testing, adding to lead times.

Addressing these challenges is crucial for unlocking the market’s full potential.

Future Outlook (2025–2032)

The rigid-flex PCB market is set to experience robust growth, with several trends defining its future trajectory:

1. Increased Aerospace Applications: With innovations like OTC’s copper-embedded rigid-flex boards, aerospace will remain a critical growth sector.
2. Digital Transformation in Procurement: Platforms like Epec’s InstantPCBQuote will become industry-standard.
3. Regional Manufacturing Expansion: Facilities like Polymatech’s Estonia plant will support localized production.
4. Integration with 5G & IoT: As wireless technologies advance, rigid-flex boards will play a larger role in high-frequency designs.
5. Sustainability Focus: Eco-friendly manufacturing methods will gain traction, aligning with global sustainability goals.

By 2032, rigid-flex technology will be even more deeply integrated into everyday devices, mission-critical aerospace systems, and advanced automotive platforms.

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The rigid-flex boards industry is undergoing a phase of dynamic transformation, marked by technological innovations, strategic partnerships, and regional expansions. With a market size expected to grow from US$ 2.8 billion in 2024 to US$ 4.9 billion by 2032, the sector promises significant opportunities for manufacturers, suppliers, and end-users alike.

Recent developments—from OTC’s space-grade PCBs and Epec’s digital procurement tools to Polymatech’s European expansion—underscore the industry’s momentum. As rigid-flex boards become increasingly vital across aerospace, automotive, medical, and consumer electronics applications, their role in shaping the next generation of electronic systems is undeniable.

In the years ahead, companies that invest in innovation, digital transformation, and sustainable practices will be best positioned to lead in this high-growth market.