The semiconductor industry is evolving at a breathtaking pace, driven by the insatiable demand for high-performance computing, artificial intelligence (AI), 5G, and next-generation consumer electronics. At the heart of this transformation lies a quiet but revolutionary material shift the move toward glass core substrates for semiconductor packaging.

Traditionally, organic substrates have served as the backbone for packaging integrated circuits (ICs). However, as chip architectures grow more complex and heterogeneous integration becomes the new norm, the limitations of conventional substrates have become increasingly evident. Issues such as thermal distortion, limited signal integrity, and difficulty in scaling interconnect density are creating bottlenecks.

This is where glass core substrates (GCS) enter the scene. Their superior dimensional stability, low coefficient of thermal expansion (CTE), smoother surfaces, and ability to integrate through-glass vias (TGVs) position them as an enabling technology for the next decade of chip innovation.

Market analysts estimate that the glass core substrate market was valued at US$195 million in 2024 and is on track to reach US$572 million by 2032, representing a robust CAGR of 17.0%. While still relatively small compared to traditional organic substrates, this explosive growth reflects both the urgency and enthusiasm surrounding this technology.

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The Market Outlook: A Rising Star in Advanced Packaging

Market Size and Growth Potential

The semiconductor packaging market has always been cyclical, but its long-term trajectory points upward thanks to the AI revolution, chiplet architectures, and high-bandwidth computing needs. Within this broader context, glass core substrates are carving out a unique niche.

• 2024 market value: US$195 million
• 2032 projection: US$572 million
• CAGR (2024–2032): 17.0%

This growth trajectory is significant because it reflects more than just incremental adoption it represents a structural shift in packaging technologies. Unlike organic substrates, which are approaching their physical and performance limits, glass substrates are just beginning to tap into their potential.

Key Growth Drivers

1. AI and HPC (High-Performance Computing)
   Training large language models (LLMs) and running inference workloads require massive bandwidth, ultra-fast interconnects, and thermal stability areas where glass substrates excel.
2. Chiplet Architectures
   Instead of monolithic SoCs, chipmakers are increasingly using multiple chiplets interconnected on advanced substrates. Glass enables denser interconnects and larger panel sizes, making it ideal for this shift.
3. Power Efficiency and Thermal Performance
   Glass reduces power consumption, offers superior heat resistance, and minimizes warping at elevated temperatures.
4. Government Incentives
   Programs like the U.S. CHIPS Act are directly funding glass substrate manufacturers, accelerating commercialization.

Recent Developments: The Industry’s Big Moves

1. Absolics / SKC – Building the U.S. Glass Substrate Hub

One of the most significant developments comes from Absolics, a U.S.-based subsidiary of SKC (part of South Korea’s SK Group). Absolics has positioned itself as a pioneer in bringing glass core substrates to mass production.

• In 2024, Absolics signed preliminary terms for a US$75 million CHIPS Act grant, earmarked to support its state-of-the-art facility in Covington, Georgia.
• The plant spans 120,000 square feet and is being developed to transition from prototypes to mass production by late 2025.
• According to SK, Absolics’ glass substrates could deliver up to 50% power reduction in certain applications, while also improving signal transmission and thermal stability.

This isn’t just about corporate growth it’s about building a U.S.-based supply chain for advanced packaging, reducing reliance on Asia, and ensuring resilience for national security-critical semiconductors.

2. Nippon Electric Glass (NEG) – Scaling TGV Technology

Nippon Electric Glass (NEG), a Japanese materials leader, is another front-runner in this space. In May 2025, NEG announced the development of two types of glass core substrates:

1. Laser modification + etching method
2. CO₂ laser method

Both are designed to support through-glass vias (TGVs), which are essential for enabling vertical interconnects in high-density packaging.

NEG has also managed to scale its substrates to 515 × 510 mm panels, a leap forward in manufacturability. This move signals readiness for panel-level packaging (PLP), a format expected to dominate advanced packaging due to its cost efficiency and scalability.

By offering both TGV-processed glass and “mother glass” without vias, NEG is creating flexibility for customers across different stages of development.

3. Intel – From In-House R&D to Licensing Strategy

Intel has been an early advocate of glass substrates, showcasing its glass interposer prototype in 2022. Initially, there were concerns that Intel might scale back its efforts. However, in 2025, Intel reaffirmed its commitment but with a twist.

• Reports indicate that Intel has begun licensing its glass substrate technology to partners, suppliers, and ecosystem players.
• This marks a strategic shift from an exclusively in-house approach to a collaborative commercialization model.
• The move could accelerate industry adoption, particularly benefiting players like Samsung Electro-Mechanics and Absolics.

For Intel, this is both a business and ecosystem play: by enabling others, Intel ensures that the ecosystem for glass substrates matures faster, which in turn benefits its own packaging needs.

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4. LPKF & Onto Innovation – Panel-Level Packaging Ecosystem

Another exciting development is the partnership between LPKF and Onto Innovation, focused on panel-level glass substrate production.

• LPKF brings expertise in laser-based via drilling and processing, while Onto Innovation specializes in inspection and metrology.
• Together, they aim to solve one of the key bottlenecks: scaling glass substrates to large panels while maintaining high yields.

This collaboration is part of the broader PACE (Panel Level Consortium), an initiative aimed at building sustainable and secure glass substrate ecosystems. By combining strengths, LPKF and Onto are accelerating the mass production readiness of glass substrates.

5. Samsung Electro-Mechanics – Building an Ecosystem

Samsung Electro-Mechanics (Semco) is also making quiet but significant moves. Reports suggest Samsung is working on building a glass substrate ecosystem, leveraging its strong presence in substrates and packaging.

Given Samsung’s dual role as both a leading memory manufacturer and a packaging powerhouse, its entry could rapidly scale the glass substrate market, especially for AI accelerators and DRAM modules.

The Technology Advantage: Why Glass Over Organics?

Glass core substrates are not just a fad they solve fundamental challenges faced by traditional organic substrates. Here’s how:

1. Dimensional Stability

Glass has a much lower coefficient of thermal expansion (CTE) compared to organic materials. This ensures minimal warping at high temperatures, which is crucial for advanced nodes and high-density interconnects.

2. Electrical Performance

The smooth surface of glass reduces signal loss and allows finer wiring pitches. This directly translates to higher bandwidth and lower latency, a must for AI and HPC applications.

3. Larger Panel Sizes

Glass substrates can be scaled to larger panel dimensions without compromising structural integrity. This supports cost-efficient panel-level packaging (PLP), reducing per-chip packaging costs.

4. Integration of TGVs

Through-glass vias (TGVs) enable 3D vertical interconnects, which enhance routing density and allow chiplets to communicate more efficiently.

Challenges and Barriers

Despite the excitement, the path to widespread adoption is not without hurdles.

1. Manufacturing Costs

Processing glass, drilling TGVs, and scaling to large panels are still expensive and yield-sensitive.

2. Equipment Ecosystem

The supply chain for glass substrate processing (laser drilling, metrology, polishing, etc.) is still in its infancy compared to organic substrates.

3. Reliability and Qualification

Chipmakers require decades-long reliability in packaging. Glass substrates must prove their endurance under conditions like thermal cycling, mechanical stress, and humidity.

4. Industry Standardization

For broad adoption, the industry needs common standards for thickness, via pitch, and panel sizes something still evolving.

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Future Outlook: Where Is This Headed?

Short Term (2024–2026)

• Pilot and prototype production by players like Absolics, NEG, and Intel.
• Initial adoption in HPC, AI accelerators, and networking chips.
• Heavy investments supported by government funding (U.S., Japan, South Korea).

Mid Term (2027–2029)

• Expansion of panel-level packaging using glass substrates.
• Broader ecosystem maturity with equipment vendors, material suppliers, and OSATs
• Entry into memory packaging (HBM, DRAM).

Long Term (2030 onwards)

• Mainstream adoption in both logic and memory packaging.
• Market size projected at US$572 million by 2032.
• Potential for glass to replace organics in high-end segments

The semiconductor packaging industry is at an inflection point. Glass core substrates, once considered a futuristic concept, are now moving rapidly toward commercial reality. With Absolics scaling in the U.S., NEG pushing TGV technology, Intel licensing its IP, and Samsung building ecosystems, the stage is set for glass to become the material of choice for next-gen packaging.