The Fraunhofer Institute for Photonic Microsystems IPMS has expanded its analytical capabilities for detecting contamination on semiconductor wafers, reinforcing its role in supporting advanced chip manufacturing and quality assurance. 

In its newly dedicated laboratory, Fraunhofer IPMS has implemented a combination of Vapor Phase Decomposition (VPD) and Inductively Coupled Plasma Mass Spectrometry (ICP-MS) to enable highly precise monitoring of wafer surface contamination. This method allows researchers to detect and quantify extremely small traces of elements that may affect the performance and reliability of semiconductor devices. 

Semiconductor wafers thin circular discs used to manufacture microchips require extremely clean surfaces to ensure optimal device functionality. Through the VPD-ICP-MS process, wafers measuring 200 mm and 300 mm are etched using hydrofluoric acid vapor. A droplet is then applied and moved across the wafer surface to collect soluble residues, which are later analyzed using ICP-MS to provide accurate quantitative data on contaminants. 

The advanced analytical setup enables ultratrace element analysis of up to 39 elements, supporting detailed surface and bevel scans. For specialized applications, aqua regia scanning solutions can also be used to detect noble metals on wafer surfaces. 

The laboratory is equipped with cutting-edge systems including the WSPS2 Wafer Surface Preparation System from PVA TePla and the iCap RQ mass spectrometer from Thermo Fisher Scientific, enabling high-precision characterization and contamination monitoring. 

With this expansion, Fraunhofer IPMS strengthens its position as a leading research institute in wafer analysis while helping semiconductor manufacturers improve production quality and device reliability. 

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