The global High Bandwidth Memory (HBM) market was valued at US$ 767.12 million in 2022 and is anticipated to reach US$ 7,029.53 million by 2024 and US$ 39,857.93 million by 2030, witnessing a CAGR of 68.08% during the forecast period 2023-2030.
The major global manufacturers of High Bandwidth Memory (HBM) include: SK Hynix, Samsung and Micron. In 2022, the world’s top two vendors accounted for approximately 90.17 % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for High Bandwidth Memory (HBM), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Bandwidth Memory (HBM).
The High Bandwidth Memory (HBM) market size, estimations, and forecasts are provided in terms of output/shipments (Million GB) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global High Bandwidth Memory (HBM) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
The drive behind the development of various 3D-stacked memories primarily stems from the increasing demand for memories that offer high bandwidth, low power consumption, and scalability. This demand is propelled by the rise of Big Data, Internet of Things (IoT), and other data-intensive applications, necessitating technologies capable of efficiently processing and storing vast amounts of information. Moreover, there is a pressing need for memories exhibiting high efficiency and performance in network systems for tasks such as data packet buffering, processing, and storage, particularly beyond 100 Gbps.
Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM), both offering bandwidths exceeding 100 Gbps, emerge as viable alternatives to DRAM due to their competitive speeds coupled with significantly lower power consumption. Furthermore, these technologies continue to undergo advancements, with HBM 2 boasting 256 Gbps of bandwidth, marking a substantial improvement over HBM 1’s 128 Gbps.
Additionally, HMC and HBM have demonstrated a remarkable reduction in energy consumption per bit compared to traditional DRAM-based memory technologies, with approximately 70% less energy consumed. For instance, at 128 Gbps of bandwidth, HBM 1 consumes only 3.30 watts, a notable decrease compared to DDR4 (its predecessor), which consumes 4.48 watts at the same bandwidth. Given these advantages, the demand for HBM and HMC is poised to surge in tandem with the escalating need for high-bandwidth, low-power, and highly scalable memories.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Bandwidth Memory (HBM) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
High Bandwidth Memory (HBM) Recent Developments:
In August 2016, SK Hynix launched HBM2, a next-generation iteration of HBM1, providing high-performance solutions for graphics, servers, supercomputers, and networking applications.
In July 2017, Samsung commenced mass production of its 8-gigabyte (GB) HBM2. Offering 256 Gbps of memory bandwidth, HBM2 caters to increasing market demands across various applications such as artificial intelligence, high-performance computing, advanced graphics, network systems, and enterprise servers.
In November 2017, AMD collaborated with Intel, a leading developer of advanced digital technology platforms, to integrate semi-custom GPUs with a multi-chip processor package.
In December 2017, Intel introduced the Stratix 10 MX FPGA, featuring integrated high-bandwidth memory HBM2. With a maximum memory bandwidth of 512 gigabytes per second, the product targets high-end applications like high-performance computing (HPC), network function virtualization (NFV), and broadcast applications.
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North America: The region is expected to hold the largest market share due to the presence of major HBM manufacturers and the increasing demand for high-performance computing (HPC) systems in the region.
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Europe: The European market is expected to grow at a steady rate due to the increasing demand for HBM in automotive and aerospace applications.
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Asia Pacific: The region is expected to witness the highest growth rate due to the increasing adoption of HBM in various industries, such as automotive, healthcare, and telecommunications.
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Rest of the World: The Middle East and Latin America are expected to offer growth opportunities for HBM manufacturers due to the increasing demand for high-performance computing systems in these regions.
By Company
- Samsung (South Korea)
- Micron (US)
- SK Hynix (South Korea)
- Intel (US)
- Advanced Micro Devices (AMD) (US)
- Xilinx (US)
- Fujitsu (Japan)
- NVIDIA (US)
- IBM (US)
- Open-Silicon, Inc. (US)
- Others
by Type
- HBM2
- HBM2E
- HBM3
- HEM3E
- Others
by Application
- Servers
- Networking
- Consumer
- Others
Production by Region
- Korea
- Taiwan
Consumption by Region
- North America :
- U.S.
- Canada
Europe :
- U.K.
- Germany
- France
- Spain
- Rest of Europe
Asia-Pacific :
- India
- Japan
- China
- Australia
- South Korea
- Rest of Asia-Pacific
Latin America :
- Brazil
- Mexico
- Rest of Latin America
The Middle East & Africa :
- South Africa
- GCC Countries
- Rest of the Middle East & Africa (ME&A)
High Bandwidth Memory (HBM) market latest Trends
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Growing demand for high-performance computing: The increasing adoption of HPC systems in various industries, such as healthcare, finance, and automotive, is driving the demand for high-bandwidth memory solutions like HBM.
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Increasing adoption of artificial intelligence: The growing use of AI in various applications, such as image recognition, natural language processing, and robotics, is fueling the demand for high-performance memory solutions like HBM.
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Miniaturization of electronic devices: The trend toward smaller and more compact electronic devices is driving the need for memory solutions that offer high bandwidth and low power consumption, which is where HBM comes into play.
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Advancements in HBM technology: The development of new HBM standards, such as HBM3 and HBM3E, is enabling higher bandwidth and lower power consumption, which is expected to drive the adoption of HBM in various applications.
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