Key Statistics
Key Takeaways
- AWG chip market was valued at USD 210.6 million in 2025 and is projected to reach USD 366.5 million by 2034, representing a 6.3% CAGR over 2026–2034.
- 100G-class AWG devices retain the largest installed base, while 200G and higher-speed wavelength-management components gain value as optical networks migrate to denser and faster links.
- Data centers are the fastest-growing application because AI clusters and cloud traffic increase optical bandwidth requirements and raise the value of compact wavelength multiplexing.
- Asia Pacific leads production and consumption through China, Japan and South Korea, where optical-component manufacturing, telecom infrastructure and hyperscale data-center investment are concentrated.
- Planar lightwave circuit technology remains the manufacturing foundation for AWG multiplexing, while silicon-photonics integration creates a path toward smaller transceiver assemblies and tighter optical-electrical co-packaging.
AWG Chip Market Overview
AWG chip market was valued at USD 210.6 million in 2025, is estimated at USD 223.9 million in 2026, and is projected to reach USD 366.5 million by 2034, advancing at a 6.3% CAGR during 2026–2034. Asia Pacific represents the largest regional market in 2025, supported by the concentration of relevant manufacturing, downstream demand and supplier ecosystems.
Arrayed waveguide grating chips are planar photonic devices that separate or combine optical wavelengths by using controlled path-length differences across an array of integrated waveguides. They perform the multiplexing and demultiplexing function required in wavelength-division systems, allowing multiple optical channels to share a fiber without active electronic switching at each wavelength.
The market is tied to optical traffic growth rather than general semiconductor unit volume. Data-center fabrics, broadband networks and mobile transport systems require more wavelength channels and higher line rates, increasing demand for compact AWG devices with low insertion loss, controlled crosstalk and stable center wavelengths across temperature.
The commercial structure of the awg chip market is shaped by design qualification, production economics and the interaction between component performance and downstream system requirements. Suppliers that can combine consistent manufacturing, application engineering and supply assurance are better positioned to convert technical eligibility into repeat business. Customer decisions increasingly account for lifecycle continuity, geographic resilience and integration cost, which makes proven process control and ecosystem compatibility as important as nominal product capability.
Segment Analysis: By Type
By type, the AWG Chip market is segmented into 100G AWG Chip, 200G AWG Chip, Others. 100G AWG chips form the mature installed base, while 200G devices and higher-speed architectures grow as carriers and data centers increase line rates. Product value depends on channel count, spacing, insertion loss, crosstalk and thermal stability rather than speed labeling alone. Purchasing decisions vary by performance requirement, qualification burden, integration complexity and lifecycle economics, so suppliers compete on application fit rather than on a single technical specification.
| Type | Role in the market | Demand characteristics |
|---|---|---|
| 100G AWG Chip | 100G AWG Chip addresses a distinct part of the product and process mix. Its commercial position depends on technical fit, manufacturing maturity, integration requirements and customer qualification rather than on headline specifications alone. | Demand is strongest where the segment aligns with established customer designs, predictable supply, and measurable system-level performance. Suppliers that can document repeatability, compatibility and lifecycle support are better placed to defend design wins. |
| 200G AWG Chip | 200G AWG Chip addresses a distinct part of the product and process mix. Its commercial position depends on technical fit, manufacturing maturity, integration requirements and customer qualification rather than on headline specifications alone. | Demand is strongest where the segment aligns with established customer designs, predictable supply, and measurable system-level performance. Suppliers that can document repeatability, compatibility and lifecycle support are better placed to defend design wins. |
| Others | Others addresses a distinct part of the product and process mix. Its commercial position depends on technical fit, manufacturing maturity, integration requirements and customer qualification rather than on headline specifications alone. | Demand is strongest where the segment aligns with established customer designs, predictable supply, and measurable system-level performance. Suppliers that can document repeatability, compatibility and lifecycle support are better placed to defend design wins. |
Segment Analysis: By Technology
By technology, the AWG Chip market is segmented into Planar Lightwave Circuit (PLC), Silicon Photonics, Others. PLC remains the established AWG platform because lithographic fabrication supports precise channel spacing and high channel counts. Silicon photonics can integrate wavelength functions more tightly with transceivers and photodetectors, reducing module size. Purchasing decisions vary by performance requirement, qualification burden, integration complexity and lifecycle economics, so suppliers compete on application fit rather than on a single technical specification.
| Technology | Role in the market | Demand characteristics |
|---|---|---|
| Planar Lightwave Circuit (PLC) | Planar Lightwave Circuit (PLC) represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
| Silicon Photonics | Silicon Photonics represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
| Others | Others represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
Segment Analysis: By Application
By application, the AWG Chip market is segmented into Broadband Network, Data Center, 5G Infrastructure. Data centers are expanding fastest because AI and cloud systems require dense optical interconnect. Broadband networks provide stable deployment volume, while 5G transport uses AWGs where wavelength multiplexing improves fiber utilization in fronthaul and backhaul. Purchasing decisions vary by performance requirement, qualification burden, integration complexity and lifecycle economics, so suppliers compete on application fit rather than on a single technical specification.
| Application | Role in the market | Demand characteristics |
|---|---|---|
| Broadband Network | Broadband Network creates demand when the underlying system requires the market’s core function at production scale. Procurement is normally tied to platform launches, equipment upgrades, capacity expansion or replacement cycles. | Buyers evaluate reliability, qualification time, integration cost and vendor support alongside unit economics. Adoption accelerates when the solution removes a system bottleneck or supports a new performance tier without creating disproportionate redesign risk. |
| Data Center | Data Center creates demand when the underlying system requires the market’s core function at production scale. Procurement is normally tied to platform launches, equipment upgrades, capacity expansion or replacement cycles. | Buyers evaluate reliability, qualification time, integration cost and vendor support alongside unit economics. Adoption accelerates when the solution removes a system bottleneck or supports a new performance tier without creating disproportionate redesign risk. |
| 5G Infrastructure | 5G Infrastructure creates demand when the underlying system requires the market’s core function at production scale. Procurement is normally tied to platform launches, equipment upgrades, capacity expansion or replacement cycles. | Buyers evaluate reliability, qualification time, integration cost and vendor support alongside unit economics. Adoption accelerates when the solution removes a system bottleneck or supports a new performance tier without creating disproportionate redesign risk. |
Segment Analysis: By End User
By end user, the AWG Chip market is segmented into Telecom Service Providers, Data Center Operators, Network Equipment Manufacturers, Research Institutions. Telecom operators buy for network capacity and lifecycle reliability, data-center operators prioritize density and power efficiency, and network-equipment manufacturers value predictable optical specifications and manufacturability. Purchasing decisions vary by performance requirement, qualification burden, integration complexity and lifecycle economics, so suppliers compete on application fit rather than on a single technical specification.
| End User | Role in the market | Demand characteristics |
|---|---|---|
| Telecom Service Providers | Telecom Service Providers represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
| Data Center Operators | Data Center Operators represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
| Network Equipment Manufacturers | Network Equipment Manufacturers represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
| Research Institutions | Research Institutions represents a relevant purchasing and deployment pathway within this market. Commercial attractiveness depends on how well it aligns with customer architecture, supply-chain constraints and required performance. | Growth is linked to design-in activity, installed-base transitions and the ability of suppliers to meet qualification, cost and availability requirements over the full product lifecycle. |
Regional Analysis
Asia Pacific leads the awg chip market in 2025, while regional growth patterns differ according to manufacturing concentration, customer investment cycles, regulation, product mix and supply-chain access. The most important regional distinction is not simply market size; it is the mechanism that converts local investment and end-market demand into qualified purchases.
How does regional demand differ across the awg chip market?
Regional demand for awg chip is structurally uneven because manufacturing assets, design centers, downstream customers and qualification ecosystems are not distributed evenly. Asia Pacific typically has the deepest electronics manufacturing base, North America combines technology development with capital investment, Europe emphasizes reliability and industrial requirements, and emerging regions are more dependent on imported systems. These differences influence vendor selection, inventory policy, service expectations and the pace at which new technologies are adopted.
| Region | Market position | Growth outlook | Demand profile | Supplier-selection gate |
|---|---|---|---|---|
| Asia Pacific | Largest | Strong | Optical manufacturing and network investment led | Yield, cost and optical performance |
| North America | High-value market | Strong | Hyperscale data-center and optical networking led | Performance and supply assurance |
| Europe | Mature technology market | Moderate | Carrier and photonics R&D led | Energy efficiency and standards |
| South America | Emerging | Moderate | Broadband and data-center led | Import cost and network investment |
| Middle East & Africa | Developing | Strong from smaller base | Data-center, 5G and backbone led | Project specification and imported supply |
Detailed Regional Blocks
Competitive Landscape
Competition in the awg chip market is determined by technical qualification, manufacturing consistency, customer relationships and the ability to support product lifecycles. Price matters, but it rarely overrides reliability, integration effort or switching cost once a supplier has been designed into a production platform.
The competitive field includes NEL, Shijia Photons, Ningbo Xinsulian Photonics, Suzhou TFC Optical Communication, Dongguan Shengchuang Technology, PPI Inc., alongside other specialized suppliers. Market share can shift when a vendor gains access to a new platform, expands qualified capacity or introduces a technology that materially improves system performance. Because customer validation can be lengthy, incumbent suppliers often benefit from continuity, while challengers need a clear technical or supply-chain advantage to displace an approved source.
Competitive strategy is increasingly multi-dimensional. Leading suppliers invest in process or product development, application engineering and regional support at the same time, while customers seek second-source options where technically feasible. This creates a market in which differentiation is sustained through documented performance, manufacturing yield, quality systems, responsiveness and the ability to support future roadmap transitions without forcing unnecessary redesigns.
| Company | Competitive position | Primary basis of competition |
|---|---|---|
| NEL | Established global / strategic supplier | Competes through product capability, qualification, account access and supply execution. |
| Shijia Photons | Established global / strategic supplier | Competes through product capability, qualification, account access and supply execution. |
| Ningbo Xinsulian Photonics | Established global / strategic supplier | Competes through product capability, qualification, account access and supply execution. |
| Suzhou TFC Optical Communication | Specialist / regional competitor | Competes through product capability, qualification, account access and supply execution. |
| Dongguan Shengchuang Technology | Specialist / regional competitor | Competes through product capability, qualification, account access and supply execution. |
| PPI Inc. | Specialist / regional competitor | Competes through product capability, qualification, account access and supply execution. |
Production Capacity Analysis
AWG chip capacity depends on planar waveguide deposition, lithography, etch precision, wafer-level optical control and fiber-coupling or packaging yield. Optical performance can drift with very small dimensional or refractive-index variations, so high production volume does not automatically translate into qualified output.
Japan and China retain strong manufacturing positions, supported by established optical-component supply chains. As silicon photonics expands, foundry access and packaging capability become increasingly important because AWG functionality can be integrated with other photonic devices rather than supplied only as a discrete chip.
Capacity should therefore be evaluated on a qualified-output basis rather than as nominal installed capability. A supplier may possess equipment or production lines that appear suitable but still require customer-specific validation, process tuning, test correlation or upstream material qualification. This distinction becomes especially important during demand spikes, when headline capacity can overstate the volume that is immediately available for a particular application, technology generation or reliability class.
Market Dynamics
The awg chip market is being shaped by rising performance requirements and technology transitions on the demand side, while qualification complexity, supply concentration and cost discipline constrain the pace of adoption. The balance of these forces favors suppliers that can solve a measurable system problem without increasing integration risk.
Demand expansion is not uniform across all product variants or customer groups. New technology creates attractive design opportunities, but buyers typically require a clear economic or performance case before changing a qualified architecture. At the same time, supply-chain localization, capacity investment and tighter quality requirements are changing procurement behavior. As a result, growth is likely to concentrate around applications where performance upgrades, manufacturing scale and lifecycle value reinforce one another.
Market Drivers
Four forces provide the strongest support for demand in the awg chip market: performance-driven technology upgrades, expansion of relevant downstream applications, investment in manufacturing or infrastructure, and the need for more resilient supply. Their importance varies by segment, but each creates a direct reason for customers to qualify or purchase additional solutions.
| Driver | Impact | Commercial mechanism |
|---|---|---|
| AI data centers increase optical bandwidth | High | Accelerator clusters require rapidly rising east-west bandwidth, supporting more optical channels and faster transceiver generations. |
| 5G and broadband networks need efficient fiber utilization | High | Wavelength multiplexing lets operators add capacity without installing proportional amounts of new fiber. |
| Higher channel density favors integrated photonics | Medium-High | AWGs scale channel count efficiently in planar circuits and can reduce size as transceiver density increases. |
| Coherent optical systems broaden wavelength-management needs | Medium-High | High-capacity metro and long-haul networks require precise optical routing and channel control around tunable lasers and receivers. |
AI data centers increase optical bandwidth
Accelerator clusters require rapidly rising east-west bandwidth, supporting more optical channels and faster transceiver generations. The commercial effect is strongest where customers can link the technology change to higher throughput, lower power, improved reliability, reduced lifecycle cost or access to a new end-market requirement.
5G and broadband networks need efficient fiber utilization
Wavelength multiplexing lets operators add capacity without installing proportional amounts of new fiber. The commercial effect is strongest where customers can link the technology change to higher throughput, lower power, improved reliability, reduced lifecycle cost or access to a new end-market requirement.
Higher channel density favors integrated photonics
AWGs scale channel count efficiently in planar circuits and can reduce size as transceiver density increases. The commercial effect is strongest where customers can link the technology change to higher throughput, lower power, improved reliability, reduced lifecycle cost or access to a new end-market requirement.
Coherent optical systems broaden wavelength-management needs
High-capacity metro and long-haul networks require precise optical routing and channel control around tunable lasers and receivers. The commercial effect is strongest where customers can link the technology change to higher throughput, lower power, improved reliability, reduced lifecycle cost or access to a new end-market requirement.
Market Restraints
Growth is moderated by qualification burden, cyclical purchasing, technology substitution and supply-chain risk. These restraints do not eliminate demand, but they can extend sales cycles, limit supplier switching and reduce the speed at which technically superior solutions convert into production revenue.
| Restraint | Impact | Commercial consequence |
|---|---|---|
| Thin-film filters and other architectures compete with AWGs | High | Alternative mux/demux technologies can offer lower insertion loss or simpler packaging for selected channel counts. |
| Temperature sensitivity requires compensation | High | AWG center wavelengths shift with refractive index and temperature unless the design uses thermal control or athermal compensation. |
| Precision fabrication and packaging affect yield | Medium | Waveguide dimensions, index control and fiber coupling must be tightly controlled to meet insertion-loss and crosstalk targets. |
| Telecom capital cycles can be uneven | Medium | Carrier spending and module inventory corrections can create abrupt demand changes even when long-term traffic growth remains strong. |
Thin-film filters and other architectures compete with AWGs
Alternative mux/demux technologies can offer lower insertion loss or simpler packaging for selected channel counts. Suppliers can mitigate part of this pressure through stronger qualification support, transparent lifecycle planning, dual-source strategies and better alignment between product roadmaps and customer production schedules.
Temperature sensitivity requires compensation
AWG center wavelengths shift with refractive index and temperature unless the design uses thermal control or athermal compensation. Suppliers can mitigate part of this pressure through stronger qualification support, transparent lifecycle planning, dual-source strategies and better alignment between product roadmaps and customer production schedules.
Precision fabrication and packaging affect yield
Waveguide dimensions, index control and fiber coupling must be tightly controlled to meet insertion-loss and crosstalk targets. Suppliers can mitigate part of this pressure through stronger qualification support, transparent lifecycle planning, dual-source strategies and better alignment between product roadmaps and customer production schedules.
Telecom capital cycles can be uneven
Carrier spending and module inventory corrections can create abrupt demand changes even when long-term traffic growth remains strong. Suppliers can mitigate part of this pressure through stronger qualification support, transparent lifecycle planning, dual-source strategies and better alignment between product roadmaps and customer production schedules.
Market Opportunities
The most attractive opportunities in the awg chip market occur where a technology transition creates measurable value and where suppliers can enter before the customer architecture is locked. Early engagement, application-specific engineering and credible supply planning can convert these windows into durable design positions.
800G and 1.6T optical systems
Higher line rates and denser optical links increase demand for compact wavelength multiplexing in data-center and transport modules. The opportunity is strongest for suppliers that can demonstrate performance with production-relevant data, provide engineering support during qualification and maintain a roadmap that gives customers confidence in long-term availability.
Silicon-photonics integration
Integrating AWG functions with photodetectors or transceiver PICs can reduce module size, coupling count and assembly cost. The opportunity is strongest for suppliers that can demonstrate performance with production-relevant data, provide engineering support during qualification and maintain a roadmap that gives customers confidence in long-term availability.
Athermal AWG designs
Passive temperature compensation reduces heater power and broadens deployment in space- and power-constrained network equipment. The opportunity is strongest for suppliers that can demonstrate performance with production-relevant data, provide engineering support during qualification and maintain a roadmap that gives customers confidence in long-term availability.
Coherent tunable laser integration
AWG-integrated tunable laser arrays can support compact coherent sources for next-generation transport systems. The opportunity is strongest for suppliers that can demonstrate performance with production-relevant data, provide engineering support during qualification and maintain a roadmap that gives customers confidence in long-term availability.
Supply Chain Analysis
Optical materials and wafers
Silica, silicon and related photonic substrates provide the platform for low-loss waveguides. Value capture at this stage depends on quality consistency, technical differentiation and the difficulty of substitution. Bottlenecks can propagate downstream when qualification or material compatibility prevents customers from shifting quickly to an alternative supplier.
AWG photonic-chip fabrication
Lithography and etching define the arrayed waveguides, slab couplers and channel geometry. Value capture at this stage depends on quality consistency, technical differentiation and the difficulty of substitution. Bottlenecks can propagate downstream when qualification or material compatibility prevents customers from shifting quickly to an alternative supplier.
Optical packaging and coupling
Fiber arrays, lenses or direct photodiode coupling convert bare photonic chips into usable modules. Value capture at this stage depends on quality consistency, technical differentiation and the difficulty of substitution. Bottlenecks can propagate downstream when qualification or material compatibility prevents customers from shifting quickly to an alternative supplier.
Network and transceiver integration
AWGs are integrated into mux/demux modules, coherent sources, data-center transceivers and telecom transport systems. Value capture at this stage depends on quality consistency, technical differentiation and the difficulty of substitution. Bottlenecks can propagate downstream when qualification or material compatibility prevents customers from shifting quickly to an alternative supplier.
Recent Developments
Recent developments show how technology roadmaps, manufacturing investment and standards are changing the competitive requirements of the awg chip market. The entries below are selected for their direct relevance to product capability, capacity, qualification or downstream adoption rather than for general corporate activity.
Furukawa Electric published next-generation tunable-light-source work using AWG-DR laser arrays for coherent optical communications. The design monolithically integrates an AWG multiplexer with a laser array, demonstrating the role of AWG structures in compact coherent sources. Source
Furukawa Electric announced an S-band Raman amplifier for broader optical-network bandwidth, highlighting continued carrier investment in expanding usable wavelength spectrum. More wavelength capacity increases the strategic value of precise mux/demux technologies across the optical chain. Source
Sumitomo Electric continues to offer compact AWG demultiplexing for CWDM4 and FR4 silicon-photonics transceivers with direct photodiode coupling, reinforcing the integration path for AWG devices in small optical modules. Source
Report Scope & Segmentation
| Report attribute | Coverage |
|---|---|
| Market | AWG Chip |
| Base Year | 2025 |
| Estimated Year | 2026 |
| Forecast Period | 2026–2034 |
| 2025 Market Size | USD 210.6 million |
| 2026 Estimated Size | USD 223.9 million |
| 2034 Forecast Size | USD 366.5 million |
| CAGR (2026–2034) | 6.3% |
| Largest Market in 2025 | Asia Pacific |
| By Type | 100G AWG Chip, 200G AWG Chip, Others |
| By Application | Broadband Network, Data Center, 5G Infrastructure |
| By Technology | Planar Lightwave Circuit (PLC), Silicon Photonics, Others |
| By End User | Telecom Service Providers, Data Center Operators, Network Equipment Manufacturers, Research Institutions |
| Companies Profiled | NEL, Shijia Photons, Ningbo Xinsulian Photonics, Suzhou TFC Optical Communication, Dongguan Shengchuang Technology, PPI Inc. |
Frequently Asked Questions
What was the awg chip market size in 2025?
The global awg chip market was valued at USD 210.6 million in 2025. The 2025 value is the base-year reference used throughout this overview and provides the starting point for comparing the 2026 estimate and the 2034 forecast.
What is the projected awg chip market size in 2034?
The global market is projected to reach USD 366.5 million by 2034. The forecast reflects the interaction of downstream adoption, technology transitions, production investment and the qualification requirements that shape commercial conversion across the market.
What is the CAGR of the awg chip market from 2026 to 2034?
The awg chip market is expected to expand at a 6.3% CAGR during 2026–2034. Growth will not be uniform across every product or region because customer qualification, capital cycles, supply constraints and application-specific performance requirements differ materially.
Which region is the largest awg chip market?
Asia Pacific is the largest regional market in 2025. Its position is supported by the concentration of relevant manufacturing, customers, technology ecosystems and downstream demand, although the precise commercial mechanism differs by country and application.
How is the awg chip market segmented by type?
By type, the market is segmented into 100G AWG Chip, 200G AWG Chip, Others. These categories address different performance, cost and integration requirements, so supplier selection depends on application fit, qualification history and lifecycle economics rather than a single specification.
What are the main applications for awg chip?
By application, the market covers Broadband Network, Data Center, 5G Infrastructure. Demand in each application is linked to platform launches, capacity expansion, equipment replacement and the degree to which the technology improves system performance or manufacturing economics.
What are the principal growth drivers for the awg chip market?
Key drivers include ai data centers increase optical bandwidth and 5g and broadband networks need efficient fiber utilization. These forces increase demand when customers can translate technical improvements into higher performance, lower cost, greater reliability or access to new applications.
What are the main restraints in the awg chip market?
Important restraints include thin-film filters and other architectures compete with awgs and temperature sensitivity requires compensation. The resulting qualification burden, purchasing cyclicality and technology risk can extend sales cycles and limit rapid supplier substitution even when new solutions offer clear technical advantages.
Which companies participate in the awg chip market?
Companies profiled in this market include NEL, Shijia Photons, Ningbo Xinsulian Photonics, Suzhou TFC Optical Communication, Dongguan Shengchuang Technology, PPI Inc.. Competition centers on qualification, product or process performance, manufacturing consistency, customer support and the ability to maintain supply across the required product lifecycle.
What should buyers evaluate when selecting a awg chip supplier?
Buyers should evaluate demonstrated performance, qualification history, manufacturing consistency, lifecycle support, supply resilience and integration cost. A technically strong product can still face adoption barriers if it increases redesign risk, lacks regional support or cannot meet the customer’s production and quality requirements.
Research Sources & Evidence Base
View research sources used for this overview.
- Furukawa Electric. R&D Leading the Next Generation — 2025 AWG-integrated tunable laser development for coherent communications.
- Sumitomo Electric. Mux/Demux attached FlexBeamGuidE — AWG use in compact CWDM4 and FR4 silicon-photonics transceivers.
- Furukawa Electric. Development of a Heater-Control AWG Module — AWG operating principle, multiplexing function and temperature behavior.
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