Heat spreaders for semiconductor packaging market was valued at USD 157 million in 2026 and is projected to reach USD 430 million by 2036, growing at a CAGR of 10.6% over 2027–2036. Asia-Pacific led with an estimated ~39% regional revenue share in 2026. SHINKO specifies C1020 and C1100 copper spreaders with nickel or selective gold plating, 10–100 mm outer dimensions and 1.0–4.5 mm thickness for CPU, server and AI packages; Asia-Pacific CPU buyers assess relevance.