Tageos and Pragmatic Semiconductor Expand Partnership to Power Smarter, Sustainable NFC Packaging
Tageos and Pragmatic Semiconductor have deepened their long-term collaboration with the launch of a new product portfolio built on Pragmatic’s flexible NFC Connect technology. The latest EOS Lite and EOS Zero Lite lines are designed to bring item-level intelligence into packaging and labels, while keeping sustainability and cost efficiency in focus.
At the center of this launch is the new EOS-932 Zero Lite PR1301, a paper-based NFC inlay that supports smart packaging, product authentication, and consumer engagement. Its ultra-thin, flexible design enables discreet integration into packaging without changing appearance, making it well suited for brands looking to connect physical products with digital experiences.
What makes this development especially relevant is;
Its balance of scalability, recyclability, and digital connectivity. By combining Pragmatic’s ultra-thin chip with Tageos’ expertise in sustainable RFID inlays, the solution opens new opportunities for high-volume manufacturing and low-carbon packaging innovation across retail and consumer goods.
With prototype samples expected by the end of Q2 2026 and volume orders targeted from Q3 2026, this partnership reflects a broader industry shift toward smarter packaging ecosystems that deliver both business value and sustainability impact.
“It’s an amazing use of our FlexIC technology to bring this innovation to market. David Moore, CEO of Pragmatic Semiconductor, stated, “With Tageos, Pragmatic Semiconductor is addressing the quickly growing opportunity to seamlessly integrate intelligence at item level and deliver sustainable, connected experiences at scale.”
“Together, both companies are creating a new era of smarter packaging, allowing direct consumer interaction with almost any product to demonstrate authenticity, strengthen trust, and unlock data-driven insights and transparency throughout the value chain.”
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