The semiconductor industry is in the midst of one of its most transformative decades, and at the heart of this shift lies a critical but often overlooked component: the blankmask. In semiconductor manufacturing, blankmasks—also known as photomask blanks—are ultra-precise substrates onto which circuit patterns are etched to create masks used in lithography. Without them, the production of advanced microchips would be impossible.

While blankmasks rarely make headlines compared to chips themselves, their importance cannot be overstated. These highly engineered plates must meet incredibly strict requirements for flatness, surface quality, and defect control—especially in extreme ultraviolet (EUV) lithography, where even a microscopic imperfection can render a multi-million-dollar wafer batch useless.

The Blankmasks for Semiconductors Market was valued at US$ 2.37 billion in 2024 and is projected to reach US$ 3.94 billion by 2032, growing at a CAGR of 6.6% during 2025–2032. This growth is being driven by the push toward smaller nodes, greater chip complexity, and the rise of advanced technologies like AI, 5G, and high-performance computing (HPC).

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The past year has seen several pivotal developments:

• Samsung is testing locally produced EUV blank masks to reduce dependence on Japanese imports.
• HOYA, the industry leader, continues to innovate and supply ultra-flat EUV blanks for cutting-edge chip production.
• Strategic outsourcing decisions are reshaping the global photomask supply chain.

These changes point toward a future where blankmask production is both a technological race and a supply chain balancing act.

Recent Developments Driving the Industry Forward

Samsung’s Push for Domestic EUV Blank Mask Supply

One of the most significant developments in 2025 is Samsung Electronics’ effort to qualify S&S Tech’s domestically produced EUV blank masks. Historically, Samsung has sourced its EUV blanks primarily from Japan’s HOYA, a company with decades of expertise in high-purity quartz substrates and defect-free multilayer coatings.

However, geopolitical tensions, export controls, and supply disruptions—such as the 2019 Japan-Korea trade dispute—have highlighted the risks of overdependence on a single country for critical materials. In response, Samsung has been actively testing S&S Tech’s EUV blank masks under real production conditions. The company aims to complete the final quality evaluation and potentially approve them for mass production use by the second half of 2025.

Why this matters:

• It signals a strategic pivot toward supply chain resilience.
• Successful approval would bolster South Korea’s domestic semiconductor ecosystem, reducing vulnerability to export restrictions.
• It could foster greater competition in a market where few suppliers meet EUV-level specifications.

The challenge, however, is immense. Producing EUV blank masks requires mastering sub-nanometer surface flatness and multilayer coating uniformity across large plates—a feat that took existing suppliers years to perfect.

HOYA’s Continuing Dominance in Photomask Blanks

Despite new competition, HOYA Corporation remains the undisputed leader in EUV photomask blanks. The company’s expertise lies in its ability to produce ultra-flat, defect-free quartz or glass substrates, then deposit more than 40 alternating layers of molybdenum and silicon with atomic-level precision to reflect EUV light.

These blanks form the foundation of the masks used by leading foundries such as TSMC, Intel, and Samsung for sub-5nm manufacturing. HOYA’s technological edge is not just in precision—it’s in volume scalability and yield rates. As EUV masks are expensive to produce and even minor defects can ruin a batch, HOYA’s ability to deliver consistent quality is a competitive advantage.

Key innovations:

• Improved pellicle integration for EUV masks, which protects the mask during exposure.
• Development of blanks optimized for High-NA EUV lithography, the next step beyond current EUV systems.
• Supply chain optimization to meet surging demand from AI and HPC markets.

HOYA’s continued leadership underscores the fact that even as regional diversification increases, certain suppliers will remain central to the global semiconductor roadmap.

Samsung’s Strategic Outsourcing of Low-End Photomasks

In a parallel move, Samsung is reportedly outsourcing the production of lower-tier photomasks—specifically i-line and KrF masks—to external suppliers. This allows the company to focus internal resources on producing advanced ArF and EUV photomasks.

Strategic benefits:

• Concentrating on higher-value mask technologies that directly support cutting-edge chip manufacturing.
• Leveraging external partners for mature-node production without disrupting supply for consumer electronics and automotive chips.
• Increasing internal capacity for next-generation lithography R&D.

The outsourcing model reflects a broader industry trend: as advanced semiconductor manufacturing becomes more capital-intensive, companies are prioritizing their core competencies while using partnerships to handle lower-margin products.

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Market Forces and Growth Drivers

Rising Demand for Advanced Nodes

The shift to smaller nodes—from 7nm to 5nm, and now toward 3nm and beyond—is a major driver of blankmask demand. Each shrink in node size increases the complexity of the mask design and the tolerance requirements for blankmask substrates.

Applications like AI training accelerators, autonomous vehicle processors, and quantum computing interfaces require chips that push lithography to its limits. As these markets grow, the demand for flawless EUV blankmasks will only intensify.

Supply Chain Resilience

The semiconductor industry learned hard lessons from the COVID-19 pandemic, natural disasters, and geopolitical tensions. The blankmask segment is particularly vulnerable because there are only a handful of qualified suppliers worldwide.

In response:

• Regional sourcing strategies are gaining momentum.
• Governments are offering incentives for domestic production of semiconductor materials.
• Suppliers are investing in multi-site production to mitigate disruption risks.

Samsung’s partnership with S&S Tech is a clear example of supply localization as a resilience strategy.

Technology Roadmaps

The next big technological leap is High-NA EUV lithography, which will require even more stringent blankmask specifications:

• Higher reflectivity coatings for improved light capture.
• Ultra-low defect densities at the atomic scale.
• Advanced cleaning processes to maintain mask integrity over more exposures.

Suppliers that can meet these demands will be well-positioned for premium pricing and long-term contracts.

Competitive Landscape

Leading Players

• HOYA Corporation (Japan) – Global leader in EUV blanks, with a strong track record of innovation.
• AGC Inc. (Japan) – Specializes in glass substrates and has growing EUV capabilities.
• S&S Tech (South Korea) – Emerging player aiming to qualify for Samsung’s EUV supply chain.
• Toppan Photomasks (Japan/Global) – Known for photomask manufacturing but also active in blank supply.

Regional Strengths

• Japan – Home to the most advanced blankmask technologies and materials expertise.
• South Korea – Increasing domestic capabilities to support memory and logic fabs.
• Taiwan – Strong in photomask design and integration with TSMC’s advanced fabs.
• S. & Europe – Focused on R&D for next-gen lithography, especially High-NA EUV.

Opportunities & Challenges Ahead

Opportunities

• AI-driven mask inspection to reduce defect rates.
• High-NA EUV blankmask production for 2nm and beyond.
• Expansion of domestic supply chains supported by government subsidies.

Challenges

• Extremely tight manufacturing tolerances.
• Long qualification cycles for new suppliers.
• High capital investment requirements for EUV-grade facilities.

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The Road to 2032: Growth Outlook

By 2032, the blankmask market will be defined by:

• EUV dominance, as older lithography nodes decline in relevance for high-performance chips.
• Regional diversification, with South Korea, Taiwan, and the U.S. increasing their share of production.
• Integration with High-NA EUV systems, enabling smaller and more efficient chips.

Market forecast by type:

• EUV blanks – Fastest growing segment.
• ArF blanks – Stable demand for mid-tier nodes.
• KrF & i-line – Gradual decline in high-tech share but stable for industrial/automotive uses.

The blankmask for semiconductors industry may operate behind the scenes, but its role is central to the future of technology. With a projected value of US$ 3.94 billion by 2032, the sector is set to grow in both scale and strategic importance.

Samsung’s domestic sourcing strategy, HOYA’s technological leadership, and the global trend toward supply chain diversification are shaping the industry’s future. Over the next decade, success will hinge on mastering nanometer-level precision, securing resilient supply chains, and staying ahead of the High-NA EUV curve.

The race for the perfect blankmask is, in essence, the race for the next generation of computing—and the players who master it will hold the keys to tomorrow’s most advanced technologies.