AI Is Getting More Powerful. The Power Electronics Behind It Are Getting Smaller.

At electronica 2026, EPC is putting GaN power technology at the center of the conversation with demonstrations spanning AI data centers, robotics, drones, autonomous machines and space electronics.

The message is clear: the next generation of computing will need more than faster processors. It will need smarter, faster and more compact power conversion.

What EPC is showcasing?

EPC is demonstrating its latest eGaN FETs, integrated power stages and reference designs, including solutions covering the path from 800VDC distribution to sub-1V processor power rails.

Among the key demonstrations:

➡6kW 800V-to-12.5V ISOP LLC converter for high-voltage AI power architectures
➡New 6kW 800V-to-6V conversion technology designed to move high-voltage power closer to next-generation AI processors
➡Gen8 GaN power stages targeting multi-megahertz, low-voltage conversion
➡100V three-phase ePower Stage ICs for compact robot and drone motor drives
➡Radiation-hardened and radiation-tolerant GaN devices for space electronics

GaN is no longer being positioned only around conventional power supplies.

EPC is targeting the rapidly developing physical AI ecosystem, where humanoid robots, drones and autonomous machines require lightweight and highly efficient motor-drive systems.

The company’s integrated GaN approach could help reduce the space and complexity required for these power architectures an important consideration as intelligent machines become more compact and increasingly autonomous.

More electrical performance from less physical space.

The most important part of EPC’s electronica showcase may not be any single device.

It is the direction of the technology.

As AI processors consume more power, robotics become more intelligent and electronic systems become increasingly constrained by size and thermal limits, power semiconductors are becoming a strategic part of system architecture rather than a supporting component.