3D IC & 2.5D IC Packaging Market, Global Outlook and Forecast 2023-2035

November 15, 2023 0 Comments

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

This report aims to provide a comprehensive presentation of the global market for 3D IC & 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging. This report contains market size and forecasts of 3D IC & 2.5D IC Packaging in global, including the following market information:

Global 3D IC & 2.5D IC Packaging Market Revenue, 2018-2023, 20242035, ($ millions)

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Global 3D IC & 2.5D IC Packaging Market Sales, 2018-2023, 20242035, (K Units)

Global top five 3D IC & 2.5D IC Packaging companies in 2022 (%)

The global 3D IC & 2.5D IC Packaging market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

We surveyed the 3D IC & 2.5D IC Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global 3D IC & 2.5D IC Packaging Market, by Type, 2018-2023, 20242035 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, by Type, 2022 (%)

3D TSV

2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Global 3D IC & 2.5D IC Packaging Market, by Application, 2018-2023, 20242035 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, by Application, 2022 (%)

Automotive

Consumer electronics

Medical devices

Military & aerospace

Telecommunication

Industrial sector and smart technologies

Global 3D IC & 2.5D IC Packaging Market, By Region and Country, 2018-2023, 20242035 ($ Millions) & (K Units)

Global 3D IC & 2.5D IC Packaging Market Segment Percentages, By Region and Country, 2022 (%)

North America

Canada

Mexico

Europe

Germany

France

U.K.

Italy

Russia

Nordic Countries

Benelux

Rest of Europe

Asia

China

Japan

South Korea

Southeast Asia

India

Rest of Asia

South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Turkey

Israel

Saudi Arabia

UAE

Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

Key companies 3D IC & 2.5D IC Packaging revenues in global market, 2018-2023 (Estimated), ($ millions)

Key companies 3D IC & 2.5D IC Packaging revenues share in global market, 2022 (%)

Key companies 3D IC & 2.5D IC Packaging sales in global market, 2018-2023 (Estimated), (K Units)

Key companies 3D IC & 2.5D IC Packaging sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

Intel Corporation

Toshiba Corp

Samsung Electronics

Stmicroelectronics

Taiwan Semiconductor Manufacturing

Amkor Technology

United Microelectronics

Broadcom

ASE Group

Pure Storage

Advanced Semiconductor Engineering

Outline of Major Chapters:

Chapter 1: Introduces the definition of 3D IC & 2.5D IC Packaging, market overview.

Chapter 2: Global 3D IC & 2.5D IC Packaging market size in revenue and volume.

Chapter 3: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: Sales of 3D IC & 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Global 3D IC & 2.5D IC Packaging capacity by region & country.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: The main points and conclusions of the report.

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Table of content

1 Introduction to Research & Analysis Reports
1.1 3D IC & 2.5D IC Packaging Market Definition
1.2 Market Segments
1.2.1 Market by Type
1.2.2 Market by Application
1.3 Global 3D IC & 2.5D IC Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global 3D IC & 2.5D IC Packaging Overall Market Size
2.1 Global 3D IC & 2.5D IC Packaging Market Size: 2022 VS 2035
2.2 Global 3D IC & 2.5D IC Packaging Revenue, Prospects & Forecasts: 2018-2035
2.3 Global 3D IC & 2.5D IC Packaging Sales: 2018-2035
3 Company Landscape
3.1 Top 3D IC & 2.5D IC Packaging Players in Global Market
3.2 Top Global 3D IC & 2.5D IC Packaging Companies Ranked by Revenue
3.3 Global 3D IC & 2.5D IC Packaging Revenue by Companies
3.4 Global 3D IC & 2.5D IC Packaging Sales by Companies
3.5 Global 3D IC & 2.5D IC Packaging Price by Manufacturer (2018-2023)
3.6 Top 3 and Top 5 3D IC & 2.5D IC Packaging Companies in Global Market, by Revenue in 2022
3.7 Global Manufacturers 3D IC & 2.5D IC Packaging Product Type
3.8 Tier 1, Tier 2 and Tier 3 3D IC & 2.5D IC Packaging Players in Global Market
3.8.1 List of Global Tier 1 3D IC & 2.5D IC Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 3D IC & 2.5D IC Packagin